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Newsletter: 4th September 2025

 
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FEATURED
3D design hub receives $3m funding


New $3M U.S. National Science Foundation grant bolsters American design and manufacturing of advanced 3D chip technologies.
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INDUSTRY NEWS
•  2Q25 foundry revenue surges 14.6% to record high
•  Tech, software, and semiconductor companies face the highest AI security risk in the S&P 500
•  AI in semiconductor manufacturing market to surpass $14.2 billion
•  Council for Science and Technology advocates for UK sovereign AI chip design industry
•  2026 IEEE Electronic Components and Technology Conference announces Call for Papers

View All Industry News
COMPANY NEWS
•  Infineon expands OptiMOS 6 portfolio
•  GlobalFoundries introduces 22FDX+ RRAM technology for wireless and AI applications
•  GlobalFoundries and Silicon Labs partner to scale wi-fi connectivity
•  OMRON exhibits production inspection advances at SEMICON Taiwan 2025
•  CG Semi unveils one of India’s first end-to-end OSAT facilities in Sanand, Gujarat

View All Company News

Artificial intelligence in multimodal microscopy workflows for failure analysis: from 3D imaging to automated defect detection
Examining how the wealth of interconnected data will fuel the development of AI-based predictive models, capable of forecasting not only the occurrence but also the timing and underlying causes of failures from their earliest symptoms. By Flavio Cognigni, Product and Application Sales Specialist XRM & Multimodal Microscopy and Heiko Stegmann, FIB-SEM application expert and advisor, Carl Zeiss Microscopy
INTERVIEWS
•  Nitrogen bubbling technology solved poor wet etching uniformity and by-product regrowth
•  SEMI Foundation acts as Coordinating Hub for major US microelectronics initiative
•  Removing the barriers to innovation
•  Scaling 3D chips with molybdenum-based metallisation

View All Interviews
LAB NEWS
•  Si2 creates LLM Benchmarking Coalition
•  Theory-guided strategy expands the scope of measurable quantum interactions
•  Fraunhofer IPMS and DIVE optimise semiconductor processes
•  EU Project ELENA pioneers LNOI Platform for next-gen photonic circuits
•  VTT joins PIXEurope, the advanced European photonics pilot line

View All Lab News
VIDEO INTERVIEW


AI enables co-optimisation of devices and materials

Vijay Narasimhan, Director of R&D Collaboration, EMD Electronics, the North American electronics business of Merck KGaA, discusses how AI for materials discovery and intelligence is helping the company to push the boundaries to revolutionize materials discovery by identifying new materials and optimising materia...

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LATEST ON-DEMAND WEBINAR


Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder

Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.

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NEWSLETTER SPONSOR: Branford


Bidding closes September 25, 2025

The Branford Group is conducting a timed online auction of advanced semiconductor assembly and test tools

Featuring late-model systems from major OEMs including ASMPT, New Power, Bojay, Upton, and Furonteer. Highlights include die attach, wire bonders, AOI, lens attach, ovens and more —many installed as recently as 2022–2023. A comprehensive chip-on-board (COB) inline solution is also featured, designed for CMOS image sensor packaging and ideal for applications in smartphone cameras, AR/VR, security, 3D sensing, medical, and automotive cameras. Bidding closes September 25, 2025.



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Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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