ICMC organisers receive annual Si2 Power of Partnerships Award
This year's award honors the organizing committee of the inaugural Si2 International Compact Modeling Conference (ICMC), held on June 26-27 in San Francisco. The ICMC was established as a collaborative platform to unite academic and industry stakeholders in sharing advancements in the development, application, and standardization of compact models for semiconductor devices. The committee successfully managed the logistical, administrative, financial, and programmatic requirements of the conference.
Committee members and honorees are:
· Peter Lee. Micron Technology
· Shahed Reza, Sandia National Laboratories
· Colin Shaw, Silvaco
· Gert-Jan Smit, NXP Semiconductors
Launched in 2019, the annual Power of Partnerships Award celebrates the achievements of Si2 member teams. The honorees exemplify the spirit of collaboration, working together to enhance silicon-to-system interoperability. "Since this was the inaugural ICMC, everything had to be created from scratch," said Robert Aslett, Si2 president and CEO. "However, they held a very successful conference with active participation from a diverse group of industry and academic leaders who shared advances in compact device model development, the application of device models in the industry, model enhancements, and the exploration of new devices and industrial applications. It was also a great forum for experienced practitioners and students to meet and get to know each other. We’re looking forward to continued success at ICMC 2026."
Aslett thanked ICMC 2025 cosponsors: Si2 Compact Model Coalition, IEEE, the IEEE Electron Devices Society, and the IEEE Microwave Theory & Techniques Society; and corporate sponsors: Micron Technology, Qualcomm, Siemens, Sandia National Laboratories and Silvaco.
