The X-FAB mixed signal foundry announced availability of 16 new process options for its 0.6micron CMOS process family. These processes can be combined in a modular fashion to fit specific application needs.

The X-FAB mixed signal foundry announced availability of 16 new process options for its 0.6micron CMOS process family. These processes can be combined in a modular fashion to fit specific application needs.

All elements of the process modules are completely qualified and characterised. Corresponding simulation models are available in the X-FAB design kit.

Non-volatile Flash memory with a storage capacity of up to 512kbits is now on offer in addition to the previously available EEPROM option. Several voltage ranges can be flexibly implemented. The transistors for the control of non-volatile memory with a mid-level voltage range of 12-18V can also be used without actual usage of the memory.
Because X-FAB focuses on the demands of the automotive industry, the technology is well suited for both the 14V and 42V PowerNet standards.

X-FAB uses a triple well concept, which consists of several wells isolated from each other. This is designed to provide trouble-free integration of circuits that have variable voltage supplies while concurrently providing a high level of immunity from interference.

"Despite the diversity of possible variants, we guarantee a high level of process security and short delivery times - an advantage of the modular concept that we combine with our sophisticated computer-aided manufacturing (CAM) system," says Thomas Hartung, vice-president of marketing and sales.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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