DISCO Corporation, a semiconductor manufacturing equipment manufacturer has completed construction of a new seismically isolated building (Building B) at Nagano Works Chino Plant (Chino City, Nagano). With completion, the total floor area of the Nagano Works Chino Plant, including the existing building, is approximately 7.5 times greater. This expansion enables further enhancement of the product supply system for future demand in semiconductors and electronic components.

Due to widespread use of high-performance smartphones and increase in base stations and data centers accompanying the start of 5G service, demand for semiconductors and electronic components, including memory, sensors, and condensers, is increasing worldwide. As a result, need is also rising for DISCO's precision processing equipment* and precision processing tools** (blades/wheels) among device manufacturers, semiconductor manufacturing subcontractors, and electronic component manufacturers. Demand is expected to expand mid-to-long term as well, with future technologies such as IoT, AI, self-driving technology, and telemedicine as drivers of growth. Therefore, DISCO needed to further enhance its product supply system.

Enhancement of Production System

Production floors in the existing building (Building A) are operating at almost full capacity. With the construction of Building B, the total floor area of the entire Nagano Works Chino Plant is 7.5 times greater than before. This expansion enables flexibility in adapting to further increase in demand. In addition, construction of another new building (total floor area: approximately 67,800 m²) is in progress at Hiroshima Works Kuwabata Plant (Kure City, Hiroshima) and will be completed in August 2021.

Improvement of BCM*** Support

Currently, production of major products is conducted mainly at Hiroshima Works Kure Plant and Kuwabata Plant. However, the distance between the factories is approx. 10 km, which is a concern should disaster affect a wide area. Therefore, diversification of risk is a major topic. After operation starts in Building B at Nagano Works Chino Plant, the variety of items that Nagano Works can produce will increase, and DISCO will work toward establishing a system that can achieve production and shipment of the same products from both Hiroshima and Nagano Works. This production system will then enable the achievement of a stable production supply in the event of an emergency.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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