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Total System In Package Launched

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ST Assembly Test Services (STATS) has qualified a “total” system-in-package (SiP) solution for PBGA, stPBGA and LGA packages along with surface mount manufacturing capability.

SiP integrates one or more ICs, passives, RF and other components in a package. STATS makes early engagements with customers at the system architecture and partitioning stage to provide thermal, electrical, and mechanical characterisation concurrently with test planning as part of the overall design and layout process.



Dr Han Byung Joon, STATS chief technology officer, comments: “SiP has become increasingly popular as it allows separately optimized technologies such as GaAs, SiGe and silicon to be integrated on a single platform.”



SiP is currently used to integrate baseband and RF devices for cellular, GPS and Bluetooth products.



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