Process Development
The memory supports popular RISC microprocessor cores such as the ARM7, ARM9
and ST10. Demonstrator chips featuring these cores are already undergoing
customer qualification for the full automotive temperature range.
Fully compatible with the basic 180nm logic process (libraries and cores),
the 180nm Embedded Flash technology includes a flexible macrocell. This
allows customer-specified memory arrays up to 10Mbits to be quickly defined,
with sectorisation down to 8kBytes. The macrocell also includes BIST
(Built-In Self-Test) features.
Motorola claims to have eliminated the limitations of existing IC packages
with its new power quad flat pack no-lead (PQFN) product. The PQFN surface
mount package is aimed at meeting the high power dissipation requirements of
automotive, industrial, marine and commercial applications.
Clem Brown, manager of power packaging development at Motorola's
Semiconductor Products Sector, reports:
"We've designed a packaging platform
that is flexible enough to accommodate almost any kind of design and
integrate up to four die in the same package - all in an amazingly small
finger-tip-size package."
The PQFN uses a 0.5mm-thick copper lead frame and heavy gauge aluminium bond
wires to efficiently transfer heat out of the package while providing low
electrical on-resistance. Conduction is the primary mode of heat transfer
that moves the generated heat away from the die surface and out of the
package through exposed heat sinks on the bottom surface of the PQFN.
Motorola is currently working on more than 20 configurations of the PQFN
package with lead counts ranging from 16 to 35. Custom versions of the PQFN
are expected to be available for unique applications or specific customers.
Motorola has applied for JEDEC registration for its line of standard PQFN-S
platform products, which range in size from 5mm to 12mm.
The first product launched in the format is Motorola's MC33982
self-protected silicon switch. This device is a 2mOhm high-side power switch
housed in a 12x12mm PQFN.
The package is expected to be qualified for commercial and industrial
applications shortly and for automotive applications by the end of the year.
The PQFN package is expected to reach volume production by the end of the
year.
Service Support Specialties (S-Cubed) introduced its Flexi-PCS photoresist
processing system. The company is represented in Europe by Hillelian
Concepts. Flexi-PCS is based upon the FlexiFab system, which has been in
production as both new and remanufactured systems since 1987.
S-Cubed has implemented PC base control for improved performance at a very
low cost. Servo motor actuation replaces the usual combination of stepper
motors and sensors. The need for a large number of sensors in traditional
tracks can hinder reliability.
Process use at 0.18 and even 0.13microns is considered possible by
representative at Hillelian. Uniformity is as good as 28Angstroms (3sigma).
The system produces conformal coatings even with 100micron side walls - a
feature that could be attractive for micro-electro-mechanical system (MEMS)
production.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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