News Article
STMicro Announces MCUs Based On 0.13-micron
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
STMicroelectronics has announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications.
The ST23YS02 and ST23YS08 integrate 2 and 8 Kbytes of EEPROM, respectively. The products are ideal for a range of finance applications, but particularly for EMV migration from magnetic stripe to SDA (Static Data Authentication) Chip and PIN cards. A simplified architecture makes them easy to use to further reduce costs for code developers.
Both MCUs embed an eDES (enhanced DES) accelerator and support AES (Advanced Encryption Services) cryptography, and are certified to meet current EMVCo requirements. They provide ISO and IART interfaces, with planned additions to the family including crypto-processor and contactless products.
"ST's new 0.13-micron family builds on more than 20 years experience in the design and manufacture of secure products for the banking industry, and is supported by our expertise in advanced non-volatile memories," said Marie-France Florentin, ST's Smartcard ICs Business Director. "Incorporating the security improvements developed over the last two years, the first small-memory devices in the family offer highly cost effective solutions for SDA migration and loyalty cards."
Samples of the ST23YS08 will be available from September 2007, with volume production planned for November; the ST23YS02 will sample in December 2007 and will be available in volume from January 2008. Both devices are supplied in wafer form or as micro-modules. Pricing for the ST23YS08 is $0.80 in quantities of 100,000 units.
The ST23YS02 and ST23YS08 integrate 2 and 8 Kbytes of EEPROM, respectively. The products are ideal for a range of finance applications, but particularly for EMV migration from magnetic stripe to SDA (Static Data Authentication) Chip and PIN cards. A simplified architecture makes them easy to use to further reduce costs for code developers.
Both MCUs embed an eDES (enhanced DES) accelerator and support AES (Advanced Encryption Services) cryptography, and are certified to meet current EMVCo requirements. They provide ISO and IART interfaces, with planned additions to the family including crypto-processor and contactless products.
"ST's new 0.13-micron family builds on more than 20 years experience in the design and manufacture of secure products for the banking industry, and is supported by our expertise in advanced non-volatile memories," said Marie-France Florentin, ST's Smartcard ICs Business Director. "Incorporating the security improvements developed over the last two years, the first small-memory devices in the family offer highly cost effective solutions for SDA migration and loyalty cards."
Samples of the ST23YS08 will be available from September 2007, with volume production planned for November; the ST23YS02 will sample in December 2007 and will be available in volume from January 2008. Both devices are supplied in wafer form or as micro-modules. Pricing for the ST23YS08 is $0.80 in quantities of 100,000 units.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
REGISTER FOR FREE
VIEW SESSIONS