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Thursday 27th September 2012
Thursday 27th September 2012
 
Wednesday 26th September 2012
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Wednesday 26th September 2012
The need for better memory, logic, power devices & image sensors will boost the need for semiconductor wafers thinner than 100µm
Tuesday 25th September 2012
The Intellectual Property (IP) includes 2D and 3D MEMS patents
Tuesday 25th September 2012
The Intellectual Property (IP) includes 2D and 3D MEMS patents
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Monday 24th September 2012
 The new system extends nanofabrication of silicon semiconductors to the sub-10 nanometre scale and can be integrated with an FIB column
Friday 21st September 2012
The photonic wire bond transmits data in the Terabit range
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Friday 21st September 2012
The Taiwan-based company was also sentenced to adopt an antitrust compliance program. Former top executives of the firm were each sentenced to serve three years in prison and to pay criminal fines
Friday 21st September 2012
A process developed by µ-LAM may eliminate the need for multiple sequential procedures, such as grinding, lapping and polishing
Friday 21st September 2012
The device could dramatically improving MEMS-based sensors such as accelerometers, gyroscopes, and cantilevers for atomic force microscopy
Thursday 20th September 2012
The company's configurable 2.4 GHz PDAs provide optimised noise and distortion performance over a 6-dB to 26-dB gain range

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