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Industry News

Tuesday 18th June 2019
U.S. Ban Takes a Toll on Huawei and on its American Memory and Storage Suppliers IHS Markit Says Micron and Western Digital contend with immediate impacts—while Huawei faces longer-term storage-supply challenges
Thursday 13th June 2019
Friday 7th June 2019
Thursday 30th May 2019
Picture credit: © Michele Simoncelli - Heat conduction in a thermoelectric illustration . Heat is the energy due to vibrations of atoms. The ridges represent the quantum vibrational energy levels of CsPbBr3, a promising thermoelectric material. Heat conduction originates from both diffusion of vibrational excitations (blurred spheres, following the energy level) and quantum tunnelling (jump between different energy levels, represented by blue waves).
Wednesday 29th May 2019
More stringent IPCC guidelines include accounting for CF4 by-product formation and emissions.
Wednesday 15th May 2019
A pulse of ultrasound traveling through a solid is attenuated as it goes and is reflected and/or transmitted by material interfaces. An x-ray beam is also attenuated but ignores material interfaces. An ultrasonic pulse must be inserted at 90° to the surface, but x-ray can be inserted at almost any angle. The usefulness of these and other differences is described by Tom Adams, consultant, Nordson SONOSCAN
Monday 13th May 2019
EPC's chief executive, Alex Lidow, believes his GaN devices now beat silicon on performance and price, reports Rebecca Pool.
Wednesday 24th April 2019
As foreign governments take big steps to advance their domestic semiconductor capabilities, new blueprint lays out research, workforce, trade initiatives needed to help keep America on top in chip technology