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Industry News


Monday 8th October 2018
The webinar will be presented in USA (9th October) and Europe (10th October) by Tom Skoczylas, engineer and the webinar in Asia (17th October) will be presented by Luc Zhu, Chief Representative in China. These presenters will cover the advantages of on-site hydrogen generation in the wafer, chip and semiconductor manufacturing process, and includes a 20 minute Live Q&A session.
Thursday 4th October 2018
Company set to make Cold Split wafering technology widely available
Monday 1st October 2018
Steven R. Rodgers is executive vice president and general counsel of Intel Corporation.
Wednesday 12th September 2018
Thursday 6th September 2018
The new IRS2007S includes integrated dead-time and shoot-through protection. It also features low quiescent currents, tolerance of negative transient voltage and dV/dt immunity. Therefore, the gate driver ensures the device reliability and reduces the BOM
Wednesday 5th September 2018
KLA-Tencor’s new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.
Wednesday 5th September 2018
SiTime and Bosch are strengthening their process and manufacturing partnership to provide innovative timing solutions for future 5G, IoT and automotive applications.

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