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Tuesday 19th September 2017
Thursday 14th September 2017
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Tuesday 12th September 2017
EV Group's state-of-the-art imprint lithography and bond-alignment technologies provide numerous benefits for manufacturing optical components at the wafer-level. Shown here is a lens wafer fabricated with the IQ Aligner® soft UV imprint lithography technology, and a bonded micro optics stack consisting of lens wafers and spacer wafers.
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Monday 11th September 2017
Thin die being attached to flexible substrates at NextFlex
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Friday 8th September 2017
In this article, Nadine Collaert (distinguished member of technical staff at imec), Anabela Veloso (principal member of technical staff at imec) and Trong Huynh-Bao (R&D engineer at imec) highlight the opportunities brought by vertical nanowire FETs and the possible device integration routes and talk about the ‘super-scaling’ of SRAM cells
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