Worldwide market revenue for NAND-type flash memory in the third quarter slightly exceeded iSuppli Corp.'s forecast— but disappointing sales of MP3 players has prompted a downgrade of our outlook for fourth-quarter sales.
Intel Corporation announced that it will increase the size of the assembly and test facility it is building in Vietnam from 150,000 square feet to 500,000 square feet and raise its investment from the USD$300 million announced in February to USD$1 billion.
The NSF Centre for High-rate Nanomanufacturing is pleased to announce the Roger H. Grace Fellowship in Nanomanufacturing. Applications are now being accepted for the Spring 2007 semester, and the 2007 – 2008 academic year.
Picogiga International, a division of the Soitec Group (Euronext, Paris) and the leader of the European HYPHEN project, has announced excellent initial material characterization results surrounding gallium nitride (GaN) on compound engineered substrates, which should enable a new range of reasonably priced, high-performance radio-frequency (RF) applications.
IPextreme Inc., and Cypress Semiconductor Corp. have signed an agreement where IPextreme will sell and support Cypress' well-proven USB 2.0 high speed hub intellectual property (IP) into third-party system chips.
Inovys Corporation, provider of Design For Test (DFT) solutions for the semiconductor industry, and ISE Labs, a subsidiary of ASE Test Limited have announced that they are partnering to provide advanced test equipment and services to their fabless customers.
MunEDA a vendor for DFM-DFY design solutions and Grand Technology Inc., an EDA distributor in Taiwan have closed an exclusive distribution agreement for sales and support of MunEDA tools and solutions in the Taiwan market.
The MicroNanoWorld key application program, at Electronica 2006 consisting of a dedicated exhibition area and the World of MEMS User Forum has been announced as finalized. Nanotechnology is one of four key applications areas that will highlight electronica 2006.
SUSS MicroTec has announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market.