Silicon Integration Initiative (Si2) announced the formation of the Low-Power Coalition (LPC) which will deliver enhanced capabilities in low-power Integrated Circuit (IC) design flows relating to specifications of low-power design intent, architectural tradeoffs, logical/physical implementation, design verification and testability.
KPIT Cummins Infosystems Limited and Renesas Technology Corp. announced Renesas has established a dedicated off-shore development centre (ODC(1)) at KPIT Cummins to strengthen its development and design capabilities.
Leading suppliers of silicon wafers participated in a consensus survey, obtained from SEMI surveying the SMG members. This survey provides an outlook for the demand in silicon units for the period 2006 – 2009.
The University of Sheffield has invested £10M to create a new Nanoscience and Technology Centre which incorporates the UK's largest cleanroom laboratory for research into semiconductors, nano-magnetics and other devices.
Major breakthroughs in the use of micro and nano technologies (MNTs) for satellite and commercial defense avionics applications were unveiled on an international scale at the CANEUS 2006 Conference held in Toulouse, France, home of Airbus Industries in France's Aerospace Valley.
UMC semiconductor foundry and Singapore's Institute of Microelectronics (IME), have sealed a partnership to jointly develop Radio Frequency (RF) modeling solutions for 90nm technologies. The cooperation will result in the development of new methodologies that are applicable for advanced technologies at 90nm and beyond.
SRS Labs, Inc. announced it has completed restructuring its business by finalizing the sale of its semiconductor subsidiary, Valence Technology Limited ("Valence"), to Noblehigh Enterprises Inc. ("Noblehigh").
Hakuto represents NexTech’s products throughout the Asia Pacific Rim countries of Japan, Korea, Taiwan, China, Singapore and Malaysia.
The NexTStar G4 NanoScan is equipped with both brightfield and darkfield illumination and is designed to inspect unpatterned glass or patterned thin films on glass substrates of dimensions 920mm X 740mm in size. The NexTStar NanoScan will provide sub-micron inspection capability for FPD/TFT panels on patterned glass for defects 300 nanometers (0.3µ) or larger in size.
The NexTStar NanoScan G4 AOI system is scheduled to be delivered to Hakuto, Japan in the late 4th Qtr. of 2006.
NexTech’s CEO, Mr. Tony Di Napoli, states, “We are especially excited about our product line-up in the FPD market. This is a 70+ billion dollar market that has been growing at a double-digit rate year-to-year. The technology advantage that we enjoy with our inspection products allows us to compete aggressively in this market as these tools play an integral role in increasing customer yields and overall manufacturing excellence.”
European semiconductor sales showed a positive development in August over July. Shipments of Microprocessors, under the spotlight in the previous months, reported a good result, in Europe as well as across other Regions.
Worldwide sales of semiconductors reached an all-time monthly record of $20.5 billion in August, an increase of 10.5 percent from the $18.6 billion reported in August 2005, the Semiconductor Industry Association (SIA) reported.