xMEMS introduces µCooling fan-on-a-chip solution for XR smart glasses
xMEMS Labs is expanding its revolutionary µCooling fan-on-a-chip platform into XR smart glasses, providing what is thought to be the industry’s first in-frame active cooling solution for AI-powered wearable displays.
As smart glasses rapidly evolve to integrate AI processors, advanced cameras, sensors, and high-resolution AR displays, thermal management has become a major design constraint. Total device power (TDP) is increasing from today’s 0.5–1W levels to 2W and beyond, driving significant heat into the frame materials that rest directly on the skin. Conventional passive heat sinking struggles to maintain safe and comfortable surface temperatures for devices worn directly on the face for extended periods.
xMEMS µCooling addresses this critical challenge by delivering localized, precision-controlled active cooling from inside the glasses frame itself – without compromising form factor or aesthetics.
“Heat in smart glasses is more than a performance issue; it directly affects user comfort and safety,” said Mike Housholder, VP of Marketing at xMEMS Labs. “xMEMS’ µCooling technology is the only active solution small, thin, and light enough to integrate directly into the limited volume of the eyewear frame, actively managing surface temperatures to enable true all-day wearability.”
Thermal modeling and physical verification of µCooling in smart glasses operating at 1.5W TDP has demonstrated 60–70% improvement in power overhead (allowing up to 0.6W additional thermal margin); up to 40% reduction in system temperatures, and up to 75% reduction in thermal resistance.
These improvements directly translate to cooler skin contact surfaces, improved user comfort, sustained system performance, and long-term product reliability – critical enablers for next-generation AI glasses designed for all-day wear.
µCooling’s solid-state, piezoMEMS architecture contains no motors, no bearings, and no mechanical wear, delivering silent, vibration-free, maintenance-free operation with exceptional long-term reliability. Its compact footprint – as small as 9.3 x 7.6 x 1.13mm – allows it to fit discreetly within even the most space-constrained frame designs.
With xMEMS’ µCooling proven across smartphones, SSDs, optical transceivers, and now smart glasses, xMEMS continues to expand its leadership in delivering scalable, solid-state thermal innovation for high-performance, thermally-constrained electronic systems.
