STMicroelectronics and Texas Instruments will offer ICs based on technology developed jointly with Nokia that together compose standard CDMA chipsets. ST and TI will market the chipsets to handset manufacturers for cdma2000 1X and 1xEV-DV (1x Evolution for Data and Voice) mobile internet handsets.

STMicroelectronics and Texas Instruments will offer ICs based on technology developed jointly with Nokia that together compose standard CDMA chipsets. ST and TI will market the chipsets to handset manufacturers for cdma2000 1X and 1xEV-DV (1x Evolution for Data and Voice) mobile internet handsets.

This technology has been incorporated in the Nokia-specific chipset used in its cdma2000 1X phones. Following generations of this technology will be used in Nokia-specific chipsets for future 1xEV-DV handsets. Availability of qualified samples of the cdma2000 1X chipset is expected next quarter.

TI and ST are uniting elements of their respective technologies into a portfolio of ICs forming CDMA chipsets that target multiple market segments and present handset manufacturers with flexibility and choice through open hardware interfaces, including interfaces to RF subsystems and application processors. An open Application Programming Interface (API) will facilitate customisation of products and accelerate proliferation.

The complete CDMA chipset will include an analogue baseband/power management chip, a digital baseband chip, associated protocol software, RF chips and reference designs. In addition to the CDMA chipset solutions, ST and TI will make available their own complementary wireless technologies including applications processors, which support the OMAPI standard, wireless LAN, Bluetooth, and GPS location technology. ST offers Flash memory products as an option to complement the chipset.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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