Motorola reports its first volume shipments of microprocessors produced using a low-k insulating dielectric during its copper metallisation process.

Motorola has applied this process to PowerPC microprocessor products including the G4 PowerPC processor and the MPC 7455 and 7457 devices. Products manufactured with this method run up to 20% faster and at lower power than those made without it while maintaining high yields and reliability.

Scientists from Motorolas DigitalDNA Laboratories in Austin, Texas originally developed the low-k process at the 0.13micron technology node. The process was reverse transferred into a high performance 0.18micron silicon-on-insulator (SOI) process for immediate product shipments. Motorola has been shipping products manufactured at the 0.18 micron SOI process since Q1 2003 and plans to ship at 0.13 micron later this year. Motorola has been shipping SOI products in volume since Q4 2001.

Dr Suresh Venkatesan, director of CMOS Development in the Digital DNA Laboratories, gives further details: "The process utilizes a hydrogenated silicon oxycarbide (SICOH) film. . . . Motorola-produced these products on 200mm wafers at its MOS-13 wafer fab in Austin, Texas."

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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