Ellipsiz Engineering Solutions arm has been contracted to supply a total utilities solution to Advanced Semiconductor Manufacturing (ASMC) of Shanghai, China. ASMC is a joint venture foundry between the Chinese government and Philips Electronics. The multi-$mn contract charges the Facilities and Service Business unit of Ellipsiz Engineering Solutions to provide a full range of utilities construction, covering the integration of all process tools for Fab 3, ASMCs new 200mm fab. The facility will be capable of 0.18micron processing. Ellipsiz support will include anticipating and resolving field installation problems, sub-fab sub-unit layout management, hook-up protocol and procedures and post-hook-up services. This is Ellipsiz first facility-based project in China.

Ellipsiz Engineering Solutions arm has been contracted to supply a total
utilities solution to Advanced Semiconductor Manufacturing (ASMC) of
Shanghai, China. ASMC is a joint venture foundry between the Chinese
government and Philips Electronics. The multi-$mn contract charges the
Facilities and Service Business unit of Ellipsiz Engineering Solutions to
provide a full range of utilities construction, covering the integration of
all process tools for Fab 3, ASMCs new 200mm fab. The facility will be
capable of 0.18micron processing. Ellipsiz support will include anticipating
and resolving field installation problems, sub-fab sub-unit layout
management, hook-up protocol and procedures and post-hook-up services. This
is Ellipsiz first facility-based project in China.
Ellipsizs Facilities and Services Business Unit previous experience
includes facilities at Chartered Semiconductor Manufacturing, Dupont
Photomask, ST Assembly Test Services, STMicroelectronics and 1st Silicon.
The company has operations in Singapore, Malaysia, Taiwan and China.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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