Heat Extractor For LEDs
When LEDs exceed their thermal limits, efficiency and lifetimes suffer dramatically with degradation commonly greater than 50%. LEDs can produce a great deal of unwanted heat. That heat is concentrated in the back of the device and must be properly dealt with.
"The unfortunate reality is that numerous systems integrators are not addressing this important fact and, in many cases, they are actually insulating the back of LEDs by using traditional circuit boards," claims OptoLum president/CEO Joel Dry.
The OptoLum technique works in the same way as a basic chimney - excess heat is pulled from the source and then drawn up and out. A tubular or channel structure uses a "thermal evacuation core" to remove heat from sensitive LEDs and transfer it safely away.
OptoLum's has three other patents currently in the "pending" queue. The company hopes its technology will allow the lighting industry to realise LED based light bulbs that fit into the current lighting infrastructure with comparable light outputs.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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