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UBM Team Work

DEK and PacTech USA have formed a solder bump technology partnership. By combining PacTech’s electroless under bump metallisation (UBM) processing with DEK’s mass imaging systems to create solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
DEK and PacTech USA have formed a solder bump technology partnership. By combining PacTech's electroless under bump metallisation (UBM) processing with DEK's mass imaging systems to create solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.


DEK provides pre-placement manufacturing solutions and ultra-fine-pitch mass imaging technologies that work in conjunction with PacTech's wafer processing systems. DEK's stencil printing platforms may be used to print solder paste patterns with a variety of solder alloys or, using DirEKt Ball Placement, to place solder balls on PacTech-processed wafers.


PacTech is a wafer bumping and packaging subcontractor using electroless nickel/gold under bump metallisation (UBM) and a variety of solder bumping techniques. The company was founded in 1995 as a spin-off of the Fraunhofer Institute and the Technical University of Berlin. PacTech USA is now offering the electroless Ni/Au UBM and mass solder bumping processes at a new facility in California, where the company provides bumping and technology services in a 180m2 Class 10,000 cleanroom.



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AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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VIEW SESSIONS
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GOODFELLOW Confirms Membership In The BSI UK Graphene Group
AP&S Expands Management At Beginning Of 2021
SUSS MicroTec Opens New Production Facility In Taiwan
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
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Cadence Announces $5M Endowment To Advance Research
Changes In The Management Board Of 3D-Micromac AG
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Panasonic Microelectronics Web Seminar
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ASML Reports €14.0 Billion Net Sales
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
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Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
TEL Introduces Episode UL As The Next Generation Etch Platform

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