Alliances
The slurries
will be marketed and sold globally by Praxair Electronics. Praxair has
supplied polishing slurries for the hard-disk data storage and ophthalmic
lens markets since 1985, with a manufacturing capacity of 8000 metric tons
per year in Indiana. In addition to polishing slurries, Praxair produces
polishing belts for the CMP market and operates a Class 10 CMP polishing lab
to develop, test and customise slurries and polishing media for the
semiconductor market. Bayer was one of the first companies to develop and
produce colloidal silica and it has been supplying colloidal silica under
the brand name Levasil for more than 40 years. The annual production
capacity of its Leverkusen facility in Germany achieves a five-figure metric
ton output.
Bayer/HC Starck has developed a range of products for CMP that covers almost
all polishing and planarisation steps in semiconductor manufacturing. In
1998, Bayer invested in a dedicated plant for production of CMP slurries
with an annual capacity of 5000 metric tons.
BTG is to co-operate with Atmel on developing a UHF RFID ISO 18000-6 type A
chip. The work will be carried out in association with BTGs RFID venture
company, RFIP Solutions.
The chip will be a read/write RFID transponder optimised for quick, accurate
reading in any country. Some 11 developers are promoting the standard for
the emerging RFID market. The device will also support the data structures
envisaged by the EPC (Auto ID Centre) as well as those developed by the
EANoUCC for identifying individual products and tracking them as they flow
through manufacturing plants, distribution centres and retail stores.
Tags incorporating the chips developed by Atmel will be used to track and
trace items such as pallets, totes, crates and trading units, in addition to
individual item identification. The technology will also be suited to the
legal requirements of the European Union.
RFIP Solutions has developed a proof of concept protocol engine, which will
be used as a benchmark to ensure that the ISO standard is interpreted in a
common and consistent manner. The agreement will allow RFIP Solutions to
participate in commercialisation.
ON Semiconductor has signed a multi-year, renewable agreement for volume
CMOS manufacturing services from Hynix. Under the terms of the agreement,
Hynix will supply production support for ON Semiconductors power management
products.
"Hynix cost-conscious business model and advanced manufacturing services
will help ON Semiconductor expand its leadership position in the power
management revolution," said Ramesh Ramchandani, vice president and general
manager of ON Semiconductors Integrated Power Devices division.
"This agreement with ON Semiconductor is an important milestone in our
strategy to grow our foundry services business," said Channy Lee,
vice-president and general manager of Hynix foundry business.
Mykrolis has signed a distribution agreement with Zurich-based Levitronix, a
manufacturer of pump products for the semiconductor and medical markets. The
agreement allows Mykrolis to market Levitronix bearingless centrifugal pumps
in select geographical locations, as well as to incorporate the pumps into
Mykrolis subsystems for sale worldwide. Mykrolis will incorporate the pump
into fluid delivery and filtration systems used for such applications as
chemical mechanical planarisation (CMP), wet etch/clean and photochemical
fluid delivery.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
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