The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security. The aim is to establish a sound technology basis for an enhanced security level in systems that are used in the civil service, in private companies and households.

The German Federal Ministry of the Interior (BMI) and Infineon Technologies have signed a Memorandum of Understanding (MoU) concerning Information Technology (IT) security. The aim is to establish a sound technology basis for an enhanced security level in systems that are used in the civil service, in private companies and households.

The contracting parties have agreed upon a close information exchange in three subjects: the security aspect in the field of smartcard technology, security of future mobile applications and the security components needed to increase the trustworthiness of PC and computer networks. The BMI and Infineon also intend to drive selected projects to promote the use of secure information technologies in Germany. Examples for such projects are the German citizen card incorporating a digital signature and BundOnline 2005 - an initiative of the German government to make available to its citizens all online-capable information services by the year 2005.

The qualified signature card for every German citizen would incorporate biometric functionality and be used for a wide range of applications in the social, employment and health services.

The PC and network security strand would include the security standards of the Trusted Computing Group (TCG). The TCG is an industry initiative that wants to standardise the requirements for a trustworthy PC and to secure it against virus attacks and unauthorised manipulation. Work on cellular phones and other mobile devices would include systems for data encryption and payment authorisation.

Dr Ulrich Schumacher, president and CEO of Infineon, comments: "Security cooperations between government and the private sector, such as the one between the German Federal Ministry of the Interior and Infineon, and the subsequent use of silicon-based solutions, have the potential to make Germany the pacesetter for such security solutions in Europe."

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS