Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.

Nikon has obtained a "significant" order for its NPS3301 300mm chemical mechanical planarisation (CMP) system that will be shipped to a leading development facility in Japan. The system will be focused on advanced 65nm copper/low-k interconnect polishing. Shipment is due this month, July 2003.

Nikon develop the CMP system on the basis of decades of lens polishing experience. The company claims performance advantages through polishing optical materials "face-up" with a unique polishing pad configuration. This technique, coupled with Nikon's high speed rotation and low pressure range extending through 0.05psi, delivers polish capability uniquely suited to address the fragile material properties of next generation copper/low k interconnect materials.

The company also claims cost saving over traditional CMP systems that use a consumable ring surrounding each wafer during the polish process adding more than $20 to a wafer's production cost. Nikon effectively eliminates this ring resulting in millions of dollars of direct cost savings per year. Overall cost for consumable material used during wafer processing is up to 50% lower than competitive systems depending upon baseline process.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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