Info
Info
News Article

Infineon, IBM And Chartered Look To 65nm And Beyond

Chartered Semiconductor Manufacturing, IBM and Infineon Technologies have agreed joint 65nm semiconductor manufacturing process development.
Chartered Semiconductor Manufacturing, IBM and Infineon Technologies have agreed joint 65nm semiconductor manufacturing process development.


The multi-year engagement will use Infineon's low-power silicon expertise with IBM's leading process technology and Chartered's efforts to create a common foundry process platform that scales from 90nm through next-generation 65nm technology and provides a path to 45nm.


The development includes variants tuned for high performance and low power. The companies have also agreed to work together with third-party providers to make a robust ecosystem of optimised design tools.


Both IBM and Chartered plan to have the jointly developed 65nm process installed in their respective 300mm fabs and to be in a position to support Infineon's outsourced demand for 65nm products.


The work will be conducted in IBM's Advanced Semiconductor Technology Center (ASTC 300) 300mm development lab in East Fishkill, New York, which began operations last month. Nearly 200 engineers from the three companies will work together to define the process technologies.



AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

REGISTER FOR FREE

VIEW SESSIONS
GOODFELLOW Confirms Membership In The BSI UK Graphene Group
Can New Advances In CMOS Replace SCMOS Sensors In Biomedical Applications?
New Plant To Manufacture Graphene Electronics
ASML Reports €14.0 Billion Net Sales
U.S. Department Of Defense Partners With GLOBALFOUNDRIES To Manufacture Secure Chips At Fab 8
Cadence Announces $5M Endowment To Advance Research
TEL Introduces Episode UL As The Next Generation Etch Platform
AP&S Expands Management At Beginning Of 2021
Panasonic Microelectronics Web Seminar
Siemens And ASE Enable Next-generation High Density Advanced Package Designs
SUSS MicroTec Opens New Production Facility In Taiwan
EV Group Establishes State-of-the-art Customer Training Facility
Obducat Receives Order For Fully Automated Resist Processing Tool From A Customer In Asia
Imec Demonstrates 20nm Pitch Line/Space Resist Imaging With High-NA EUV Interference Lithography
Tescan And 3D-Micromac Collaborate To Increase The Efficiency Of Failure Analysis Workflows
Changes In The Management Board Of 3D-Micromac AG
Onto Innovation Announces New Inspection Platform
DISCO's Completion Of New Building At Nagano Works Chino Plant
Will Future Soldiers Be Made Of Semiconductor?
ITRI And DuPont Inaugurate Semiconductor Materials Lab
Belgian Initiative For AI Lung Scan Analysis In Fight Against COVID-19 Goes European
K-Space Offers A New Accessory For Their In Situ Metrology Tools
Tower Semiconductor Announced Program Creating An Integrated-Laser-on-Silicon Photonics Foundry Process
South Korean Point Engineering Chooses ClassOne’s Solstice S8 For Advanced Semiconductor Plating

Info
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification} Array
Live Event