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ASM Cuts ALD Operation In Europe

ASM International intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly develop atomic layer deposition (ALD) technology. At the same time, staffing at ASM’s Finnish subsidiary will be reduced by about 20 to 25 people as part of earlier announced restructuring plans of ASM's front-end operations.
ASM International intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly develop atomic layer deposition (ALD) technology. At the same time, staffing at ASM's Finnish subsidiary will be reduced by about 20 to 25 people as part of earlier announced restructuring plans of ASM's front-end operations.


As part of the Helsinki agreement, ASM intends to relocate its Espoo, Finland, research and development activities to the nearby campus of the University of Helsinki.


The co-operation is scheduled to take full effect in November 2003. Pending completion of the necessary procedures with the employees and the co-operation agreement with the University, it will involve the deployment of equipment and about 10 to 15 ASM Microchemistry scientists and engineers to the University campus.


At the same time, ASM has completed the move of substantially all operations of its Polygon ALCVD product-line to the USA. ASM had previously relocated manufacturing and part of the engineering to the USA.



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