ASM International intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly develop atomic layer deposition (ALD) technology. At the same time, staffing at ASM’s Finnish subsidiary will be reduced by about 20 to 25 people as part of earlier announced restructuring plans of ASM's front-end operations.

ASM International intends to enter into a long-term co-operative agreement with the University of Helsinki to jointly develop atomic layer deposition (ALD) technology. At the same time, staffing at ASM's Finnish subsidiary will be reduced by about 20 to 25 people as part of earlier announced restructuring plans of ASM's front-end operations.

As part of the Helsinki agreement, ASM intends to relocate its Espoo, Finland, research and development activities to the nearby campus of the University of Helsinki.

The co-operation is scheduled to take full effect in November 2003. Pending completion of the necessary procedures with the employees and the co-operation agreement with the University, it will involve the deployment of equipment and about 10 to 15 ASM Microchemistry scientists and engineers to the University campus.

At the same time, ASM has completed the move of substantially all operations of its Polygon ALCVD product-line to the USA. ASM had previously relocated manufacturing and part of the engineering to the USA.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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