IBM plans to use chemical vapour deposition (CVD) low-k technology at the 90nm node. This is a blow to Dow Chemical, the producer of the spin-on SiLK dielectric. Dow and IBM have worked together for some time.

IBM plans to use chemical vapour deposition (CVD) low-k technology at the 90nm node. This is a blow to Dow Chemical, the producer of the spin-on SiLK dielectric. Dow and IBM have worked together for some time.

Use of SiLK at IBM was one of Dow's most effective arguments for a spin-on low-k solution. It now appears that IBM will be using Novellus Systems' Coral material deposited by CVD.

Dow says that this move effectively delays the first potential high-volume use of its SiLK semiconductor dielectric resin at IBM until the 65nm node. Dow reports that IBM has confirmed the production viability of SiLK, and has built and shipped customer parts using it, but for business reasons chose to pursue CVD technology for the 90nm node.

Dow also says that it remains committed to the family of SiLK resins and maintains ongoing commercial and development relationships with leading industry players.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

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