Infineon Sets Out Green Packaging
Usually, lead is found in lead finish, solder balls and solder paste, while halogen substances are used for PCB (printed circuit board) assembly and component moulding compounds. Based on industry standard specifications, lead-free means less then 0.1% (1000ppm) lead content in DRAMs and modules and halogen-free is specified as less then 0.09% (900ppm) of chlorine and bromine content.
The European Union Directive Waste of Electrical and Electronic Equipment (WEEE), requires products sold within the EU countries to be recycled, beginning in January 2007. The directive covers a broad range of common electronic hardware. The elimination of lead and halogens will help to make the recycling process easier and less costly. There is also a Restriction of Hazardous Substance (ROHS) directive, which bans the use of lead and certain other hazardous materials beginning in July 2006.
Infineon's TSOP packaged components based on its 110nm-process will be both lead- and halogen-free. This includes 256Mbit, 512Mbit and 1Gbit densities of double data rate (DDR) components in TSOP packages along with special memory types such as GraphicsRAM, MobileRAM, and CellularRAM. Unbuffered modules based on the "green" 256Mbit DDR TSOP components are available now, and other components will be available later in the year. FBGA packages of DDR and DDR2 including the corresponding memory modules will be gradually transferred to "green" processes starting in mid 2004.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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