University Seeks Nanoimprint Partners
NIL is a recently introduced technique for the production of nano electronic circuits by pressing a stamp into a polymer heated above its glass transition temperature followed by cooling and release of the stamp. The pattern structures are then metallised and the substrate lifted off.
To make the measurements, a polymer with fluorescent markers is used instead of the normal nanometre-scale patterning polymer. When the circuits have been stamped, imprint samples are scanned and the fluorescence intensity is calculated for each part of the surface, revealing the adhesion as well as local polymer deposits.
This analysis provides information on the conditions under which the whole process takes place as well as validation of the quality of the final products. This method does not significantly increase production costs while providing a useful tool for routine quality control.
The partners are currently working on the development of software that will automate the scanning process to make the method even faster, user-friendly and more reliable.
The researchers are seeking collaboration in terms of further research or development support and venture capital/spin-off funding, along with agreements in the shape of joint ventures, licences, marketing or manufacturing.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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