SUSS MicroTec has developed a method of plasma surface activation and wafer to wafer bonding for silicon on insulator (SOI) and strained silicon applications. nano PREP reduces the process temperature to 200C allowing new applications for wafer level integration of CMOS and micro-electro-mechanical systems (MEMS) or CMOS and nanotechnology. The technology uses atmospheric pressure plasma to generate a molecular level surface modification to enable the low temperature bonding.

SUSS MicroTec has developed a method of plasma surface activation and wafer to wafer bonding for silicon on insulator (SOI) and strained silicon applications. nano PREP reduces the process temperature to 200C allowing new applications for wafer level integration of CMOS and micro-electro-mechanical systems (MEMS) or CMOS and nanotechnology. The technology uses atmospheric pressure plasma to generate a molecular level surface modification to enable the low temperature bonding.

Traditionally, direct wafer bonding (DWB) requires a high temperature anneal at 1000C after the wafers are joined together in order to increase the interface bond strength. These high temperatures limit the types of materials that can be joined and the point in the processing when they can be joined. For applications using fully processed wafers such as CMOS and MEMS devices the maximum allowable temperature is less than 400C.

"The application of atmospheric pressure plasma is a new idea for the surface activation of semiconductor materials", says Dr Franz Richter, CEO of SUSS MicroTec. "Testing shows that this technology significantly reduces direct wafer bonding process temperatures. It can be accomplished with extremely high throughput without the financial burden of expensive vacuum systems. It completely changes the cost of ownership model for these applications."

The patent pending method of surface activation and subsequent bonding was developed in co-operation with MPI Halle and Fraunhofer IST, Braunschweig, Germany.
The technology is available as an optional process module on SUSS' modular 300mm production system for direct wafer bonding (SOI300) or as a standalone module.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

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