Motorola is to provide Honeywell with access to magneto-resistive random access memory (MRAM) non-volatile memory chip technology, under a technology transfer and licensing agreement.

Motorola is to provide Honeywell with access to magneto-resistive random access memory (MRAM) non-volatile memory chip technology, under a technology transfer and licensing agreement.

Honeywell plans to develop radiation-hardened MRAM non-volatile memory for military and aerospace products such as satellites where data processing and storage performance is critical. MRAM memory elements will be integrated into Honeywell's radiation-hardened silicon-on-insulator (SOI) technology.

Honeywell and Motorola collaborated with the US Defense Advanced Research Project Agency (DARPA) in the initial research and development of MRAM.

Currently, electronic memory is sensitive to bursts of high or low amounts of radiation that interrupt power, requiring auxiliary systems to prevent data corruption and loss. By contrast, MRAM stores data through a magnetic cell structure rather than through transistor cells, eliminating the need for the auxiliary systems that add weight, require storage and often are less reliable. MRAM also offers speed, memory ability and the integration of multiple memory-options on the same chip.

SOI is currently used on Honeywell's radiation-hardened RAM and application specific integrated circuit components for space and in operating environments where radiation exposure may cause memory failure.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.

So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.

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