Copper Clip Support
Copper clip interconnects are a "bond-less" packaging technology whereby a small metal slab attached to the die surface replaces bonding wires. The process connects the active area of a die to the package leadframe using a specially designed copper conductor rather than making the connection with multiple thermosonically bonded gold wires.
The technology is typically used for MOSFET (metal-oxide-silicon field effect transistors) devices in various package types, including system in package (SiP). The advantage of bond-less technology is that it provides significantly improved electrical performance when compared with multiple gold wires. On a MOSFET device, one copper clip can replace 15 gold wires and lower the static drain-source on-resistance (RDSon) by about 30% in addition to providing an improved current distribution into the device.
Carsem will install the relevant process, tooling and materials for copper clip interconnect solutions for both prototyping and production purposes. Carsem and ST will jointly perform functional, thermal, and mechanical simulations to validate the packaging technology and will include these studies and results in their respective products. Other than some specific patented die related technologies provided by ST, Carsem will be able to provide the copper clip technology solution to their customer base across their package portfolio.
Maurizio Ferrara, product engineering manager of ST's Discretes and Standard ICs Group, comments: "The last few years have seen an acceleration in product development for non-isolated DC/DC converters for communication applications in the QFN ‘halved brick' package size. The MLP is the right technology solution to make the most of advanced silicon in a chip scale package to meet the challenge of creating advanced circuitry and well performing thermal design, so that suppliers can differentiate their product portfolio for the most demanding customers/applications."
Carsem provides turnkey packaging and test services.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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