New systems architectures are available for realising a true modular kit system for production tools while allowing existing software solutions to continue to be used. Bernd Engers and Jens Schultz of angaris describe a four-level model for use by everyone in the industry - from the component supplier to the OEM, the end-customer and the factory...

The more and more widespread introduction of microsystem technologies and the ensuing call for an integration of optical, mechanical and fluid-technical components into microchips, too, has lead to entirely new demands on technology and the production systems required for their realisation. A number of further production technologies, such as micro-moulding and mechanical micro-machining are now being added to the list of known semiconductor-based micro-structuring technologies, leading to an enlargement of the spectrum of necessary production systems and their respective funding.

A further development is the ever-increasing tendency by OEM suppliers to provide not only with specialised components but complete subsystems for the manufacturing systems produced by OEMs. These subsystems turn into important decentralised and independently working machine parts when the components and technologies are functionally integrated. In the case of a change in technologies in the factory, these subsystems are easily exchangeable without having to change the entire production system. For a number of years, similar concepts have led to an increased degree of flexibility in the automotive industry, a reduced time to market and, finally, a quicker return on investment (ROI).

It is becoming increasingly difficult for the communication structures within and between production systems that have developed over the years to keep up with these two trends so crucial for the entire semiconductor industry. New communication concepts for system technology have become necessary to satisfy future requirements.

Production of Microsystems

Microsystems are microchips in which not just electronic but also optical, mechanical and fluid-technical functions have been integrated - bio-chips are a recent example. When manufacturing such systems, new materials need to be integrated, since silicon can only be used as a basic material in exceptional cases. As a consequence, the structuring procedures currently in use in the semiconductor industry are only applicable within limits. The large variety of available materials results in a similar variety of structuring procedures.

In order to make all the necessary technologies available in a factory, investments must be made in specialised machinery with costs exceeding by far the current customary investment levels in the semiconductor industry. It is for this reason that the production of microsystems has up to now been limited to those cases where large quantities could be produced employing procedures already in use within the semiconductor industry. Due to the above-mentioned investments that are important and necessary and the smaller numbers of products to be sold, production has not been very lucrative for other applications.

This situation would appear in a different light if a dramatic reduction of investment costs and, therefore, a faster ROI even for smaller numbers of pieces could be achieved. One idea currently discussed by many OEMs and suppliers consists in modularisation of the production systems and the ensuing development of component suppliers into subsystem suppliers. This solution could be advantageous for all parties - the OEM profits from a significantly reduced amount of development work and the subsystem supplier can ensure a favourable market position by optimising cost and performance of the subsystem, while at the same time guarding its intellectual property rights. Eventually, the end-customer reduces his amount of engineering work and, what is even more important, profits from significantly lower investment costs.

However, the realisation of these ideas on modular production systems requires the definition of mechanical as well as communication interfaces that allow for all possible modules to interact and communicate with a basic system.

Modern automation architecture

A comparison of the automation architecture in the automotive industry with its counterpart in the semiconductor industry shows a distinctly higher degree of flexibility on the part of the car producers, resulting from a much more simplified and better organised automation architecture. Taking over this basic model of communication seems to be an acceptable way of taking the necessary steps towards a modern automation architecture in the semiconductor industry.

Including certain specific changes and supplements, a communication concept can be developed from this basic model, and this concept would satisfy the new demands as well as requirements specific to the semiconductor industry.

The architecture proposed is based on a three-level model: at the highest level, the factory level, communication is carried out via Ethernet. This allows the use of the communication possibilities already in existence in every factory as well as the use of all servers and databases. This also means that all the specialised production planning and controlling systems can be employed. The second level, called the cell level, is purely a communication level between the manufacturing tools. It interconnects all production systems. At this level, too, the existing tools can, for instance, be used for run-to-run control. Finally, at the third level, called the equipment level, a complete restructuring process and the consistent use of a field bus such as Profibus or DeviceNet is necessary. The choice of the field bus best suited for the requirements is up to the individual OEM and the choice in Europe will probably differ from that in the USA or Japan. It will finally depend on the communication capabilities of the intelligent modules, inter-working with a separate communication protocol at the fourth level. This protocol can be purely analogue and/or digital as the simplest solution, or a field bus-based protocol in more complex cases - the choice of the module is entirely up to its supplier.

Fig.1: Three-level model for communications

Transition to a consistently decentralised automation concept in the semiconductor industry would satisfy the needs of new technologies to be integrated and allow use of the highly sophisticated and semiconductor-specific production and controlling tools as well as software solutions for Advanced Equipment Control / Advanced Process Control (AEC/APC). The architecture meets the requirements of transforming the supplier of highly specialised components into a supplier of complete, intelligent, decentralised modules. This provides a base for more flexibility, thereby achieving a reduced time to market and a quicker return on investment on the part of the production tools.

Decentralised subsystems

Introduction of a standardised automation architecture that is nevertheless prepared for innovations as well as the protection of intellectual property will mean that any supplier that wants to remain competitive will have to face increased demands. Delivered modules have to be provided with intelligent communication possibilities to enable them to link up with Profibus, DeviceNet, CC-link or other field buses and match the different communication concepts, field bus systems or different programming approach of OEMs.

The subsystems being of different degrees of intelligence in terms of complexity, require an automation structure adapted to the relevant situation. At best, it will suffice to carry out communication within the module on an analogue and digital basis, e.g. in a simple gateway module. Expensive field bus gateways for every individual part are not necessary in this case and will only lead to avoidable costs. However, with increasing size and complexity of subsystem - e.g. a decentralised CVD module with a complex gas supply on site and complicated controlling tasks - it may be thoroughly sensible to carry out intra-modular communication on a field bus basis and transfer the control of the module to an SPS. These two examples serve to elucidate the point that it is entirely up to the supplier to choose the degree of simplicity or complexity of the module, depending on how much intelligence is desired for the module. The requirements on the part of the OEM and the final customer will certainly have a strong influence on this decision. The only pre-set standards are those elaborated by the field bus organisations, such as those that have already been in use successfully in other industrial fields for a number of years.

A number of solutions with different degrees of intelligence are available from the industry to link the signals from the different field buses. From pure gateways of analogue, digital or serial signals to universal bus interfaces provided with individual intelligence and miniaturised modular systems with field bus link (Match-X), suitable means of communication with the field buses for virtually every task are available on the market. Hence, there is no reason why component suppliers can't realise the necessary intelligent decentralised subsystems.

AngelTech Live III: Join us on 12 April 2021!

AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!

Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.

2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.

We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.

We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.

Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.

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