News Article
IMEC And CEA-LETI Collaborate On Effectiveness
The research centres gear up cost effective silicon photonics prototyping service.
IMEC and CEA-LETI launch ePIXfab, the continuation of their successful multi project wafer silicon photonics prototyping service started in 2006. Co-funded by the European Union through the Seventh Framework Programme and co-ordinated by IMEC, ePIXfab aims at reducing the large barriers for access to and market take up of silicon photonics technology by focusing on reduced cost, risk and design effort, education, and roadmapping.
With their joint initiative ePIXfab, IMEC and CEA-LETI continue to offer a cost effective way for researchers and SMEs (small and medium sized enterprises) to prototype photonic integrated circuits in silicon. ePIXfab organises shuttle (also called multi project wafer) fabrication runs with IMEC and LETI wafer scale technologies, including 193nm deep UV lithography based processes. Now, IMEC and LETI have agreed to significantly extend this service to enable a broader market take up of silicon photonic IC technology. Dedicated prototyping and small volume manufacturing is also possible based on IMEC or LETI technology.
Starting in September 2008, the PhotonFAB project will provide the ePIXfab service with a more extensive technology portfolio, new design libraries, education and training for the clients, a shuttle service roadmap and a more streamlined operation. Funded by the European Union as a FP7 Support Action, PhotonFAB will in this way lower the design effort, risk and bare costs for the clients. In addition, clients from countries fully associated to the FP7 programme will be able to get additional cost reductions for the shuttle service and training activities.
Silicon photonics IC technology enables versatile and highly functional integrated circuits that handle light information. Photonic integrated circuits are used in applications such as communication networks, sensors, monitoring and bio analysis. Using silicon allows to increase the functionality of a photonic chip by several orders of magnitude. By manufacturing with CMOS technology, the chips are reliable and can be used in volume applications.
Since 2006, thanks to the collaboration between IMEC and CEA-LETI, over 25 academic and SME groups have been able to perform their research and develop their IC technology in a fabless way with reduced costs, by joining many IC designs in a single fabrication run.
With their joint initiative ePIXfab, IMEC and CEA-LETI continue to offer a cost effective way for researchers and SMEs (small and medium sized enterprises) to prototype photonic integrated circuits in silicon. ePIXfab organises shuttle (also called multi project wafer) fabrication runs with IMEC and LETI wafer scale technologies, including 193nm deep UV lithography based processes. Now, IMEC and LETI have agreed to significantly extend this service to enable a broader market take up of silicon photonic IC technology. Dedicated prototyping and small volume manufacturing is also possible based on IMEC or LETI technology.
Starting in September 2008, the PhotonFAB project will provide the ePIXfab service with a more extensive technology portfolio, new design libraries, education and training for the clients, a shuttle service roadmap and a more streamlined operation. Funded by the European Union as a FP7 Support Action, PhotonFAB will in this way lower the design effort, risk and bare costs for the clients. In addition, clients from countries fully associated to the FP7 programme will be able to get additional cost reductions for the shuttle service and training activities.
Silicon photonics IC technology enables versatile and highly functional integrated circuits that handle light information. Photonic integrated circuits are used in applications such as communication networks, sensors, monitoring and bio analysis. Using silicon allows to increase the functionality of a photonic chip by several orders of magnitude. By manufacturing with CMOS technology, the chips are reliable and can be used in volume applications.
Since 2006, thanks to the collaboration between IMEC and CEA-LETI, over 25 academic and SME groups have been able to perform their research and develop their IC technology in a fabless way with reduced costs, by joining many IC designs in a single fabrication run.
AngelTech Live III: Join us on 12 April 2021!
AngelTech Live III will be broadcast on 12 April 2021, 10am BST, rebroadcast on 14 April (10am CTT) and 16 April (10am PST) and will feature online versions of the market-leading physical events: CS International and PIC International PLUS a brand new Silicon Semiconductor International Track!
Thanks to the great diversity of the semiconductor industry, we are always chasing new markets and developing a range of exciting technologies.
2021 is no different. Over the last few months interest in deep-UV LEDs has rocketed, due to its capability to disinfect and sanitise areas and combat Covid-19. We shall consider a roadmap for this device, along with technologies for boosting its output.
We shall also look at microLEDs, a display with many wonderful attributes, identifying processes for handling the mass transfer of tiny emitters that hold the key to commercialisation of this technology.
We shall also discuss electrification of transportation, underpinned by wide bandgap power electronics and supported by blue lasers that are ideal for processing copper.
Additional areas we will cover include the development of GaN ICs, to improve the reach of power electronics; the great strides that have been made with gallium oxide; and a look at new materials, such as cubic GaN and AlScN.
Having attracted 1500 delegates over the last 2 online summits, the 3rd event promises to be even bigger and better – with 3 interactive sessions over 1 day and will once again prove to be a key event across the semiconductor and photonic integrated circuits calendar.
So make sure you sign up today and discover the latest cutting edge developments across the compound semiconductor and integrated photonics value chain.
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