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Wednesday 27th February 2013
With a spectacular 60 percent growth in 2012, Apple and Samsung were the top consumers of MEMS microphones last year. They accounted for a combined 54 percent of all MEMS microphones shipped
Wednesday 27th February 2013
While Qualcomm increased its lead at the top from 2007 to 2012, Texas Instruments plummeted from second to sixth place
Wednesday 27th February 2013
The firm will exhibit its digital solutions for flow, vacuum and pressure measurement with partner SCH Electronics at booth #5505
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Tuesday 26th February 2013
The company is now churning out some 4 million MEMS devices a day
Monday 25th February 2013
The two organisations are collaborating to advance ASIP design, reducing the cost, performance and power consumption of mobile systems-on-chip
Friday 22nd February 2013
Promoted from director of memory cell engineering, Ken Mackay will take charge of leading the integration of Crocus’ magnetically enhanced semiconductor technology to final product quality stage
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Friday 22nd February 2013
The manufacturer of plasma etch, strip and deposition systems for critical surfaces in the semiconductor and related industries has signed an agreement with S3 Alliance. S3 will work with R&D, MEMS and production fabs
Friday 22nd February 2013
The new WTR1625L and RF front end chips harness radio frequency band proliferation, enabling OEMs to develop thinner, more power-efficient devices with global 4G LTE mobility
Friday 22nd February 2013
Of the five, Samsung tops the list. Foundries are expected to show the biggest capacity gains through 2017
Thursday 21st February 2013
The integrated motor drivers accelerate product design by eliminating external components and software development
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Thursday 21st February 2013
A new video standard enables a fourfold increase in the resolution of TV screens. MIIT says its chip was the first to handle it in real time
Thursday 21st February 2013
Using the same set of design rules and models, no extra mask layer or special process is required, translating into cost saving and design flexibility in memory
Wednesday 20th February 2013
Wednesday 20th February 2013
The firm has made a critical step forward in realising LPP light sources for mass producing EUV lithography equipment
Wednesday 20th February 2013
Stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance

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