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Friday 31st May 2013
A novel new lens could lead to improved photolithography, nanoscale manipulation and manufacturing and high-resolution 3D imaging
Friday 31st May 2013
The company will demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus at this year's Semicon West. Amicra will exhibit at Moscone North Hall in booth #5884
Friday 31st May 2013
Jointly developed with leading EDA providers, the process flows address AMS challenges from specification to verification
Friday 31st May 2013
The license covers advanced RFSOI-based design, process and third-party sourcing
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Thursday 30th May 2013
The World Semiconductor Council has reached a consensus on key trade policy initiatives. The group will present a plan of action to global governments and authorities
Thursday 30th May 2013
The firm's DRM and SPICE model V0.1 tool certification provides chip designers early access to TSMC's 16nm FinFET process
Thursday 30th May 2013
Innovative ams architecture enables board designers to locate the new AS3721 PMIC and the applications processor - both intense hotspots - far away from each other
Thursday 30th May 2013
Feedback from Electronic Design Automation (EDA) practitioners is the key to evolution of standards fostering interoperability and innovation as chip-design methodology grows more complex
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Wednesday 29th May 2013
The Xilinx 'FinFast' program aims to deliver test chips in 2013 and the first product in 2014
Wednesday 29th May 2013
The aim of the joint project is to provide a cost-effective buffer material to enable fabrication of gallium nitride (GaN) devices on silicon substrates
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Tuesday 28th May 2013
Tyndall and Intel researchers will investigate next generation materials, devices and photonics technologies to enable key innovations for future electronic devices
Tuesday 28th May 2013
Tuesday 28th May 2013
The firm has been ranked #1 in a number of categories by its customers
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