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Thursday 21st February 2013
A new video standard enables a fourfold increase in the resolution of TV screens. MIIT says its chip was the first to handle it in real time
Thursday 21st February 2013
Using the same set of design rules and models, no extra mask layer or special process is required, translating into cost saving and design flexibility in memory
Wednesday 20th February 2013
Wednesday 20th February 2013
The firm has made a critical step forward in realising LPP light sources for mass producing EUV lithography equipment
Wednesday 20th February 2013
Stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance
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Wednesday 20th February 2013
As an importer/exporter, Vishay must comply with all government regulations when shipping goods internationally. Any associated violation of these regulations could negatively impact Vishay’s reputation and future earnings
Wednesday 20th February 2013
Many leading manufacturers will discuss photonic integrated circuits versus silicon photonics, retooling for 450mm wafers and power-source issues in EUV tools
Tuesday 19th February 2013
The joint effort will develop innovative engine-train and smart-power products
Tuesday 19th February 2013
MEMS packaging is evolving in a different direction to front-end processing. Packaging standardisation will become increasingly critical in order to support the massive volume growth in unit shipments, and decrease overall costs
Tuesday 19th February 2013
The aim of the new General Manager is to help Korea become one of the world's major countries employing MOCVD manufacturing technology
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Monday 18th February 2013
Although the decline narrowed in Q4 2012, the full year ended at -11 percent
Monday 18th February 2013
The cores are in volume production with multiple customers globally
Monday 18th February 2013
LED expert and ex Osram board member Martin Goetzeler will take over from Paul Hyland on March 1st, 2013
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Friday 15th February 2013
One of the topics for discussion will involve the transition from 300mm wafers to 450mm wafers and from UV lithography to EUV lithography
Friday 15th February 2013
The firm's GCAPTM targets a range of industrial applications as well as research labs, advanced gas analysis and biomedical screening
Friday 15th February 2013
Henkel has developed a new type of paste with enhanced thermal conductivity for power modules such as those based on silicon. It allows a higher power density for the same ageing resistance
Thursday 14th February 2013
Smartphones and media tablets are still the prime movers in technology, with the two mobile platforms spurring a double-digit increase in the market for microelectromechanical system (MEMS) motion sensors this year
Thursday 14th February 2013
One of the plans is to establish a new fabless company with the integration of Fujitsu Semiconductor's system LSI business with that of Panasonic Corporation. The firm's are also deciding whether to transfer Fujitsu Semiconductor's Mie Plant to a new foundry company in collaboration with TSMC

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