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Tuesday 27th November 2012
ST's and PNI's technologies enable intuitive motion sensing for Nintendo's latest gaming applications
Tuesday 27th November 2012
The supplier of wafer bonding and lithography equipment for the MEMS  industry has doubled its cleanroom space and is advancing long-term growth plans
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Monday 26th November 2012
Imec and Holst Centre will present nine papers at the 60th International Solid-State Circuits Conference (ISSCC), taking place on February 20th to 24th, 2013 in San Francisco
Monday 26th November 2012
The firm's new R-IN32M3 series includes support for multiple protocols required for industrial Ethernet communication including CC-Link IE and EtherCAT
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Thursday 22nd November 2012
The IMPROVE project, which focuses on wafer fab efficiency and LENS, which targets the lithography supply chain have been honoured for innovation
Thursday 22nd November 2012
According to ABI Research, this could be the start of a platform war between Apple & Samsung
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Tuesday 20th November 2012
Tuesday 20th November 2012
The facility expansion integrates operations in South Korea and will support continued growth in advanced flip chip, advanced wirebond and 3D packaging
Monday 19th November 2012

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