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Tuesday 13th November 2018
Monday 12th November 2018
Siltectra's Cold Split technology will be used to double the number of chips per SiC wafer.
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Friday 2nd November 2018
By Mark Firth is Technical Director of Ichor Systems
Tuesday 30th October 2018
New two-story, 27,000 square foot construction to accommodate administrative functions
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Wednesday 24th October 2018
Wednesday 24th October 2018
Platform will allow FBH to automate a number of III-V plating-related processes on a single tool
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Wednesday 24th October 2018
Working with an expert can help to optimize essential drying variables such as level of cleanliness, drying speed, and adjustments for product geometry
Wednesday 17th October 2018
Exhibits include hetero-integrated chips for terahertz applications that combine InP and silicon

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