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Wednesday 12th September 2018
Tuesday 11th September 2018
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Thursday 6th September 2018
The new IRS2007S includes integrated dead-time and shoot-through protection. It also features low quiescent currents, tolerance of negative transient voltage and dV/dt immunity. Therefore, the gate driver ensures the device reliability and reduces the BOM
Wednesday 5th September 2018
KLA-Tencor’s new Kronos 1080 wafer inspection system and ICOS F160 die sorting and inspection system are designed to address a wide variety of IC packaging challenges.
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Wednesday 5th September 2018
SiTime and Bosch are strengthening their process and manufacturing partnership to provide innovative timing solutions for future 5G, IoT and automotive applications.
Wednesday 5th September 2018
This cross-sectional transmission electron microscope image shows a sample used for the charge-to-spin conversion experiment. The nano-sized grains of less than 6 nanometers in the sputtered topological insulator layer created new physical properties for the material that changed the behavior of the electrons in the material. Credit: Wang Group, University of Minnesota
Wednesday 5th September 2018
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Monday 3rd September 2018
PIC design house's report provides an analysis of different foundries' capabilities, facilities, equipment, processes, component libraries
Monday 3rd September 2018

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