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Thursday 13th August 2009
Scottish Semiconductor Supplier Forum merges with National Microelectronics Institute
Thursday 13th August 2009
Rapid recover ramp in the semiconductor equipment market says The Information Network
Thursday 13th August 2009
Peter Uddfors appointed as new CEO for Micronic Laser Systems AB
Monday 10th August 2009
Amalfi Semiconductor fuels growth with $24 Million funding
Monday 10th August 2009
Infineon’s Wireline division will become LANTIQ
Friday 7th August 2009
A recent update from The McLean reports shows the number of companies expected to exceed $1 billion is the lowest in a decade.
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Thursday 6th August 2009
IDT to move from fab-lite to fab-less model by transferring internal fabrication processes to TSMC
Thursday 6th August 2009
Sales of NAND flash memory for mobiles expected to increase
Wednesday 5th August 2009
Toshiba selects Obducat NIL technology
Tuesday 4th August 2009
China IC Market predicted to reach $100 Billion in 2013.
Tuesday 4th August 2009
Silicon wafer shipments grow in the second quarter.
Monday 3rd August 2009
Rudolph Technologies acquires Adventa Control Technologies
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Tuesday 21st July 2009
Inventory and chip revenue to rise in second half according to new report from iSuppli
Friday 17th July 2009
Intel successfully completes Wind River acquisition
Thursday 16th July 2009
SEMI announces mid-year consensus forecast for chip equipment Industry
Wednesday 15th July 2009
EV Group to collaborate with Applied Materials on thin wafer bonding technology for 3D IC development
Wednesday 15th July 2009
New company to focus on pre-owned lithography services
Wednesday 15th July 2009
SAFC Hitech roadmap plots route for semiconductor materials
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Wednesday 15th July 2009
Nano Green Technology Wins 2009 Best of West Award
Wednesday 15th July 2009
Phyworks bucks trend with shipment of 20 millionth chip
Tuesday 14th July 2009
IMEC and SUSS MicroTec to collaborate on wafer bonding for 3D integration applications
Tuesday 14th July 2009
UGent and IMEC announce potentially show stopping results for future nano communication
Tuesday 14th July 2009
SOITEC announces collaboration with IBM to develop wafer level 3D integration technology
Tuesday 14th July 2009
FEI Company Joins SEMATECH on metrology research at UAlbany NanoCollege

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