+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
News Article

UCSB scientists create silicon-based laser for DARPA

Team overcomes  lattice mismatch to integrate light-emitting quantum dots on silicon

DARPA's Electronic-Photonic Heterogeneous Integration (E-PHI) program has successfully integrated billions of light-emitting quantum dots on silicon to create a silicon-based laser. 

The researchers, who were working on the program at the University of California, Santa Barbara (UCSB), not only generated light emission on silicon but overcame lattice mismatch  - a common problem in past efforts to grow non-silicon laser materials directly on silicon. 

Above: Optical micrograph of III-V lasers monolithically integrated on Silicon substrates

DARPA started the E-PHI program in 2011 with a goal of integrating chip-scale photonic microsystems with high-speed electronics directly on a single silicon chip. Although many photonic components can now be fabricated directly on silicon, realising an efficient laser source on silicon has proven to be very difficult. Traditional approaches to adding lasers - and by extension, gain material - on-chip include separately fabricating lasers on expensive wafers, which then have to be bonded onto silicon chips. This conventional bonding process requires extreme precision and time that drives up the cost of production.

In a paper published by Applied Physics Letters, engineers at UCSB showed it was possible to deposit successive layers of indium arsenide material directly on silicon wafers to form billions of light-emitting quantum dots. 

This method of integrating electronic and photonic circuits on a common silicon substrate could eliminate wafer bonding, and has application in numerous military and civilian electronics where size, weight, power and packaging/assembly costs are critical.

"It is anticipated that these E-PHI demonstrator microsystems will provide considerable performance improvement and size reduction versus state-of-the-art technologies," said Josh Conway, DARPA program manager for E-PHI. "Not only can lasers be easily integrated onto silicon, but other components can as well, paving the way for advanced photonic integrated circuits with far more functionality than can be achieved today."

In addition to generating light emission on silicon, the UCSB team overcame lattice mismatch  - a common problem in past efforts to grow non-silicon laser materials directly on silicon. The UCSB team proved lasers grown on silicon performed comparably to those grown on their native substrate. These results are now serving as a foundation for the development of other photonic components such as optical amplifiers, modulators and detectors.

Purdue, imec, Indiana announce partnership
Resilinc partners with SEMI on supply chain resilience
NIO and NXP collaborate on 4D imaging radar deployment
Panasonic Industry digitally transforms with Blue Yonder
Global semiconductor sales decrease 8.7%
MIT engineers “grow” atomically thin transistors on top of computer chips
Keysight joins TSMC Open Innovation Platform 3DFabric Alliance
Leti Innovation Days to explore microelectronics’ transformational role
Quantum expansion
indie launches 'breakthrough' 120 GHz radar transceiver
Wafer fab equipment - facing uncertain times?
Renesas expands focus on India
Neuralink selects Takano Wafer Particle Measurement System
Micron reveals committee members
Avoiding unscheduled downtime in with Preventive Vacuum Service
NFC chip market size to surpass US$ 7.6 billion
Fujifilm breaks ground on new €30 million European expansion
Fraunhofer IIS/EAS selects Achronix embedded FPGAs
Siemens announces certifications for TSMC’s latest processes
EU Chips Act triggers further €7.4bn investment
ASE recognised for excellence by Texas Instruments
Atomera signs license agreement with STMicroelectronics
Gartner forecasts worldwide semiconductor revenue to decline 11% in 2023
CHIPS for America outlines vision for the National Semiconductor Technology Center
TSMC showcases new technology developments
Alphawave Semi showcases 3nm connectivity solutions
Greene Tweed to open new facility in Korea
Infineon enables next-generation automotive E/E architectures
Global AFM market to reach $861.5 million
Cepton expands proprietary chipset
Semtech adds two industry veterans to board of directors
Specialty gas expansion
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: