News Article

Path To Sensors Interoperability - IEEE SA Sensors Series Live Webinar


Path to Sensors Interoperability

Interoperability between a sensor, a gateway and an end-user's application is the “Achilles' heel” for IoT sensor manufacturers and solution providers. Industry experts are looking for the right wireless protocol to provide the scalability, security and flexibility needed to overcome these challenges.

Focus on:

· Common interoperability challenges for IoT end-users

· Certifications issues

· Choosing the right wireless protocol between wireless gateways and sensors

· IEEE's path to achieving interoperability for IoT enabled sensors

3D-Micromac AG Appoints Hartmut Schubert To Chief Technology Officer
NTU Singapore Launches Quantum Science And Engineering Centre
YES Partners With Osiris For Edge Film Removal Technology
Imec Demonstrates Significant Performance Gains Utilizing Backside 3D SOC Interconnects
Edwards Launches New Cryopump
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Brewer Science Presents Best Practices For Workplace Culture At SEMICON West
CEA-Leti Unveils Navigation-Grade Gyroscopes
The All-round Smart Proximity Sensor Chip
BASF And Entegris Sign Agreement On Sale
3D-Micromac AG Appoints Marko Gerlach Chief Financial Officer
SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration
ALD Is Taking Off In More-than-Moore Applications
Siemens Collaborates With PDF Solutions To Boost IC Yield And Speed Time
Park Systems Combines AFM With White Light Interferometry
Kurt J. Lesker Acquires KDF Electronics & Vacuum Services
CEA-Leti Breakthrough For Next-Generation Memories And RRAM Energy-Storage
EV GROUP Brings High-speed High-precision Metrology To 3D Heterogeneous Integration
ERS Electronic Appoints Mark Wachter As Chief Financial Officer
Mycronic Receives Order For An SLX Mask Writer
Detecting And Classifying Defects In Semiconductor Manufacturing Via Atomic Force Microscopy
Are You Facing Decisions And Challenges With Interconnects, Pattern Transfer, 3D Scaling And Atomic Scale Processing And Integration?
ULVAC Expands Process Capability

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event