+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

SiLC Technologies advances Machine Vision

News

Bridging the AI gap with Bionic Vision.

In a world increasingly driven by artificial intelligence (AI), the need for machines to perceive and understand their surroundings in the same way as humans has never been more pressing. Addressing this need, SiLC Technologies (SiLC) has revealed the availability of four specialized Eyeonic™ Vision Systems. Engineered for vision detection capabilities that span from short distances to over 1,250 meters, these systems utilize FMCW LiDAR technology to meet the diverse application needs across various sectors.

Current machine vision systems largely rely on camera systems that capture a mere snapshot of the available data. This necessitates resource-intensive computing to compensate for the missing pieces and inherently falls short of genuine vision.

Introduced last year, the Eyeonic Vision System delivers 'unparalleled' vision perception to machines – offering not only the capability to identify objects even beyond a kilometer away but also providing per-pixel velocity and polarization information, unprecedented precision, and interference-free operation.

“Since the launch of the Eyeonic Vision System, our collaboration with various OEMs revealed distinct vision requirements, necessitating multiple versions of our solution,” said Mehdi Asghari, SiLC founder and CEO.

SiLC’s refined Eyeonic Vision System portfolio includes:

• Short Range – Designed for vision detection up to 50 meters, this version is ideal for AI machine vision tasks requiring high precision, such as pallet and truck loading or product inspection.

• Medium Range – For vision detection up to 150 meters, suited to home security and factory automation applications.

• Long Range – Providing vision detection up to 300 meters, this version is tailored for ADAS and autonomous vehicles.

• Ultra-Long Range – For vision detection that exceeds 1,250 meters and is targeted to drone tracking, perimeter security and airplane ground control.

To date, SiLC believes that it is the only company that has built a chip-integrated FMCW LiDAR solution, which is critical for machine vision to emulate the human eye. “Our mission is to change the current state of machine vision, empowering the next generation of machines to integrate seamlessly into our society,” added Asghari. “As AI continues its upward trajectory, SiLC is poised to further innovate in response to market demand. The Eyeonic Vision System is just the start. We’re focused on enhancing angular resolution and embedding solid-state scanning into our single-chip solution.”

Tektronix and EA Elektro-Automatik offer expanded power portfolio
83% of supply chains can’t respond to disruptions in 24 hours
CMC Microsystems and ventureLAB sign MoU
Renesas introduces FemtoClock 3 timing solution
Mycronic receives order for SLX mask writer
Rapidus reveals US subsidiary and opens Silicon Valley office
Infineon introduces news MOTIX motor gate driver IC
Brewer Science unveils Smart Warehouse Monitor System
Symposium to showcase breakthroughs in microelectronics
CHIPS for America promotes over $50 million funding opportunity
SEMI University launches in-person courses
Samsung Electronics to establish Texan semiconductor ecosystem
Semiconductor chips drive innovation in AI and industries
Semiconductor equipment sales slip to $106.3 billion
Mouser Electronics receives 2023 Global Best Service Distributor of the Year Award from Diodes Incorporated
Quantum processor testing and measurement facilities up and running
Semiconductor Research Corporation announces 2024 call for research
Trend report unveils the future of circular electronics
PCIM Europe 2024: highlights and new records
PI contributes to technology node development
QP Technologies achieves ANSI/ESD S20.20 Certification
Renesas commences operations of Kofu Factory
TRI wins three Innovation Awards
Tektronix and recently acquired EA Elektro-Automatik offer expanded power portfolio
NEDO approves Rapidus’ FY2024 Plan and Budget
SK hynix signs Advanced Chip Packaging agreement
Renesas expands Quick Connect Studio
Infineon and Amkor deepen partnership
AP&S establishes site in the USA
Dracula Technologies selected by STMicroelectronics
RAIN RFID data to transform corporate sustainability initiatives
Integrated AMR replaces reed switches and hall effect sensors
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: