News Article

Applied Materials Unveils EBeam Metrology System


Applied Materials has unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.

Advanced chips are built one layer at a time, and each of billions of individual features must be perfectly patterned and aligned to create working transistors and interconnects with optimal electrical characteristics. As the industry increasingly moves from simple 2D designs to more aggressive multipatterning and 3D designs, a commensurate breakthrough in metrology is needed to perfect each critical layer and enable the best performance, power, area-cost and time to market (PPACt).

Traditionally, patterning control has been achieved using optical overlay tools that help align die patterns with “proxy targets” which are guide marks printed into the spaces between die that are removed from the wafer during die singulation. Proxy target approximation has been complemented with statistical sampling of a small number of die patterns from across the wafer.

However, after successive generations of feature shrinking, broader adoption of multipatterning, and the introduction of 3D designs that cause interlayer distortions, the traditional approach is leading to measurement deficiencies - or “blind spots” - that are making it more difficult for engineers to correlate intended patterns with on-die results.

With the arrival of new eBeam system technology that can directly measure semiconductor device structures across the wafer and through layers at high speed, customers are moving to a new patterning control playbook based on big data. Applied's latest eBeam metrology innovation - the PROVision 3E system - is especially designed for this new playbook.

“As the leader in eBeam technology, Applied Materials is giving our customers a new playbook for patterning control that is optimized for the most advanced logic and memory chips,” said Keith Wells, Group Vice President and General Manager, Imaging and Process Control at Applied Materials. “The resolution and speed of the PROVision 3E system allows it to see beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip. This provides chipmakers with the multidimensional data sets they need to improve PPAC and accelerate the time to market of new process technologies and chips.”

EV Power Electronics: Driving Semiconductor Demand In A Chip Shortage
SEMI Applauds European Chips Act
Leybold Launches Small High Vacuum System For R&D
SkyWater Signs Technology Transfer And License Agreement With Deca
Tektronix Releases Results Of Its Global Engineer Survey 2021
Xenics Expands Its Bobcat Product Family And Makes SWIR Cameras Affordable.
Webinar: Next Generation Optical Spectrum Analyzer
YES Acquires Kanthal’s Semiconductor Equipment Business
PragmatIC Semiconductor Re-invents Iconic Processor
Applied Materials Unveils EBeam Metrology System
Path To Sensors Interoperability - IEEE SA Sensors Series Live Webinar
Renault To Create Better Brand Visibility For Qualcomm In EV Market
Excellent Batch Process Results With Picosun New Generation Tools
Edwards Officially Opens New Flagship Service Technology Centre In Dublin
Sivers Semiconductors’ Japanese Customer Takes Step Towards Mass Production
Linton Crystal Technologies Uses AI To Detect Crystal Structure Loss, Notify Operator
PragmatIC Semiconductor Secures $80 Million Funding
Pfeiffer Vacuum Presents A Cloud-based Solution For Service Management
Advantest Introduces Evolutionary V93000 EXA Scale SoC Test System
New OmniControl Universal Control Unit For Pumps And Measurement Instruments From Pfeiffer Vacuum
Merck Launches Semiconductor Materials Webinar Series
Edwards Opens Lab At Hillsboro Innovation Center
SiTime Enables Up To 25% Faster Wireless Charging
Picosun Strengthens Its Position In The Semiconductor Market

Search the news archive

To close this popup you can press escape or click the close icon.
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.

Please subscribe me to:


You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
Live Event