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SUSS MicroTec And SET To Develop Equipment Solution For 3D Chip Integration

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SUSS MicroTec and SET have announced a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers. This solution will accelerate the industry's path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.

Saint-Jeoire, France and Garching, Germany - September 1st, 2021 - SUSS MicroTec -leading supplier of equipment and process solutions for the semiconductor industry- and SET -leading supplier of high precision flip-chip bonders- signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.

As part of this partnership, SUSS MicroTec's high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET's latest ultra-high accuracy D2W hybrid bonding platform.

As today's 2.5D and 3D packaging schemes are limited by the minimum interconnect density that traditional microbump technology can offer, hybrid bonding solves this problem by bonding the direct contact between two metal pads (mostly copper) and surrounding dielectrics in one single bonding step. This bumpless bonding approach allows for substantially smaller pitches and higher interconnect density which are the key enablers for future generations of multi-die solutions.

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