+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor

News

SiLC Technologies (SiLC) has announced the launch of its powerful, compact vision sensor delivering coherent vision and chip-scale integration to the broader market. The new Eyeonic Vision Sensor takes LiDAR to a new level of performance by providing accurate instantaneous depth, velocity, and dual-polarization intensity information while enabling immunity to multi-user and environmental interference. These features will enable robotic vehicles and machines to have the necessary data to perceive and classify their environment and help them predict future dynamics using low-latency, low-compute power and rule-based algorithms.

Harvesting the additional information that is carried by photons, Eyeonic is the foundation for the next generation of machine vision. The Eyeonic Vision Sensor is a first-of-its-kind FMCW LiDAR transceiver. At the nexus of the Eyeonic Vision Sensor is SiLC's silicon photonic chip which integrates LiDAR functionality into a single, tiny chip. Representing decades of silicon photonics innovation, this chip is the only readily-integratable solution for manufacturers building the next generation of autonomous vehicles, security solutions and industrial robots.

“Eyeonic will be transformational to many industries across the globe by enabling the anticipated mass migration to coherent imaging,” explained Mehdi Asghari, founder and CEO, SiLC. “Our unique technology and innovative manufacturing process puts SiLC in the optimal position to provide the key building blocks needed for this next wave of significant innovation – at a competitive price.”

Keenly driven by the technology challenges of commercializing silicon photonics, SiLC's integration platform brings together high-performance components into a single silicon chip through mature semiconductor fabrication processes, offering a low-cost, compact, and low-power solution.

“Eyeonic represents one giant step forward in the quest to bring true vision to machines," said Kris Peng, president at UMC Capital. “This is the first step toward a scalable, lightweight, low-cost solution that can measure the full motion of any object - without any prior training.”

The ability to manufacture commercial-grade coherent LiDAR solutions has become a pacing factor for market growth – a situation that SiLC is remedying. SiLC intends to make this technology available to all system integrators and end-users, starting with enabling early access to strategic partners in autonomy, security and industrial applications. Offered in two configurations, fiber and fiberless, Eyeonic addresses the current roadblocks facing industries that rely upon vision sensors to embrace burgeoning market opportunities. Fiberless vision sensors have long been sought after as they enable the lowest cost in a compact configuration. The fiber pigtailed Eyeonic allows for design flexibility by supporting configurations where the FMCW LiDAR transceiver and scanning unit are at different locations.

SPEA donates test equipment to university in Thailand
SONOTEC and S3 Alliance join at SEMICON Europa
Luminaries like high-NA EUV and curvilinear photomasks
SensiML and Silicon Technology join forces
TRI launches high-performance 3D AXI
SONOTEC and S3 Alliance join at SEMICON Europa
Marquee Semiconductor expands Indian presence
Micron begins Memory Manufacturing Fab
SiLC Technologies advances Machine Vision
Renesas partners with EdgeCortix
Gradiant acquires H+E Group
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
EdgeCortix set to disrupt the edge market?
Evonetix places first DNA Synthesis Development Platform at Imperial College London
ASE launches Integrated Design Ecosystem
Cohu acquires Equiptest Engineering
Advantest wins 2022 Best Supplier Award from ASE Holdings
SEMI welcomes new board members
Advanced Energy breaks ground on flagship factory
GlobalFoundries opens new Malaysia office
TSMC reveals 'breakthrough' set to redefine the future of 3D IC
Delphon announce new VP, strategic marketing & business development
Particle Measuring Systems Announces Acquisition of EMS
Ireland begins high-volume production of Intel 4 Technology
Advantest to showcase latest test solutions
200 gigabits per second
KemLab Inc. applauds CHIPS Act's commitment
200mm fabs to reach record capacity by 2026
Governor DeSantis dedicates $50 million for workforce development
DOD names eight 'Microelectronics Commons' Hubs
TSMC accelerates renewable energy adoption
Mouser signs global agreement with MediaTek
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: