+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

DISCO opens new R&D centre

News

Haneda R&D Center to support high demand in the semiconductor and electronic components markets

DISCO Corporation, a semiconductor equipment manufacturer, has announced the opening of its Haneda R&D Center in Higashikojiya, Ota-ku, Tokyo. The aim is to strengthen R&D and support high demand in the semiconductor and electronic components markets in the future.

For this reason, the R&D Center at DISCO’s head office (Omori-Kita, Ota-ku, Tokyo) has been operating close to full capacity. With the opening of the Haneda R&D Center, the floor space dedicated to R&D will be 2.2 times greater than previously, enabling the establishment of a system that can flexibly respond to diverse development needs, says the company.

DISCO has established Kure Plant and Kuwabata Plant, Hiroshima Works (both in Kure City, Hiroshima Prefecture) and Chino Plant, Nagano Works (Chino City, Nagano Prefecture) as production sites while product development is mainly carried out at the R&D Center, Head Office.

While up until this point the production sites have conduced verifications in preparation for mass production of new products, the opening of the Haneda R&D Center will allow these verifications to be conducted at this R&D location, according to the company.

In addition, while a large number of employees from the head office go to work at the production sites in Hiroshima and Nagano as support during periods of high demand, going forward, these employees will be able to provide support while still in Tokyo with utilisation of the space in Haneda.

SPEA donates test equipment to university in Thailand
SONOTEC and S3 Alliance join at SEMICON Europa
Luminaries like high-NA EUV and curvilinear photomasks
SensiML and Silicon Technology join forces
TRI launches high-performance 3D AXI
SONOTEC and S3 Alliance join at SEMICON Europa
Marquee Semiconductor expands Indian presence
Micron begins Memory Manufacturing Fab
SiLC Technologies advances Machine Vision
Renesas partners with EdgeCortix
Gradiant acquires H+E Group
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
EdgeCortix set to disrupt the edge market?
Evonetix places first DNA Synthesis Development Platform at Imperial College London
ASE launches Integrated Design Ecosystem
Cohu acquires Equiptest Engineering
Advantest wins 2022 Best Supplier Award from ASE Holdings
SEMI welcomes new board members
Advanced Energy breaks ground on flagship factory
GlobalFoundries opens new Malaysia office
TSMC reveals 'breakthrough' set to redefine the future of 3D IC
Delphon announce new VP, strategic marketing & business development
Particle Measuring Systems Announces Acquisition of EMS
Ireland begins high-volume production of Intel 4 Technology
Advantest to showcase latest test solutions
200 gigabits per second
KemLab Inc. applauds CHIPS Act's commitment
200mm fabs to reach record capacity by 2026
Governor DeSantis dedicates $50 million for workforce development
DOD names eight 'Microelectronics Commons' Hubs
TSMC accelerates renewable energy adoption
Mouser signs global agreement with MediaTek
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: