+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Keysight enable system-on-a-chip makers with new test solutions

News

Keysight Technologies, a technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, has announced that the company’s new 224G Ethernet test solutions enables system-on-a-chip (SoC) makers to validate next generation electrical interface technology, accelerating 1.6 terabit per second (1.6T) transceiver design and pathfinding.


5G, artificial intelligence (AI) and internet of things (IoT) applications are driving growth in data traffic, creating unprecedented bandwidth demands in networks and data centers. High-speed digital interfaces that support 224 Gbps per lane data connection speeds offer increased bandwidths and underpin 1.6 terabit per second (1.6T) high-speed interconnect technology. Improved data throughput and efficiency in data center networks also reduce power consumption and cost. Keysight is the only provider of bit error ratio tester (BERT) solutions capable of generating and analyzing 224 gigabit per second (224 Gbps) signals.

“Keysight is pleased to enable Synopsys, and other semiconductor makers, capture early market opportunities associated with the transition from 800 gigabit per second (800G) to 1.6T,” said Dr. Joachim Peerlings, vice president of Network and Data Center Solutions at Keysight Technologies. “Keysight’s unique portfolio of high-speed digital interface test solutions enable Synopsys to validate the performance of 224G IP designs accelerating 1.6T design and pathfinding.”

The M8050A BERT offers users a unique 224 Gbps test solution for electrical design and validation of transceiver SoCs used in data centers and networks for transferring large amounts of data at high speeds. Keysight’s M8050A BERT provides signal integrity that enables accurate characterization of receivers used in next-generation data center networks and server interfaces. Synopsys used Keysight’s M8050A BERT, M8199 Arbitrary Waveform Generator (AWG) and Infiniium UXR-Series Oscilloscope to develop and validate 224G serializer/deserializer (SerDes) IP designs.

“High-performance computing systems depend on high-speed, low-latency interfaces to process massive amounts of data with minimal power,” said John Koeter, senior vice president of marketing and strategy for the Solutions Group at Synopsys. “As a leading provider of high-speed Ethernet IP solutions, Synopsys utilizes Keysight’s comprehensive digital interface test solutions to validate the performance of the PHY IP, enabling designers to meet their design and system-level requirements for high-performance computing, networking and AI SoCs.”

At the European Conference on Optical Communication (ECOC) 2022 in Basel, Switzerland, Keysight and Synopsys will demonstrate the industry’s first common electrical interface (CEI) SoC supporting 224Gbps. Exhibition visitors can view the demonstration at the booth hosted by the Optical Internetworking Forum (OIF), an industry organization that promotes the development and deployment of interoperable networking solutions and services for optical networking products, network processing elements and component technologies.

Photonis announces agreement to acquire Xenics, a leader in Infra-Red imaging solutions
Phlux Technology Secures £4m in Seed Funding
Start-ups: build up your ecosystem
Trends in the semiconductor industry
Advantest Unveils E5620 DR-SEM for Review and Classification of Ultra-Small Photomask Defects
Xenics introduces Wildcat+ 640
Advantest Introduces New inteXcell Series
Sony Semiconductor Israel Redefines IoT Connectivity Platform
Sensor Sales Stay Strong Due to Big ASP Rise
Advantest Launches ACS Solution Store to Enable Real-Time Data Analytics Solutions
Lam Research Acquires SEMSYSCO to Advance Chip Packaging
Infineon planning a major investment in a new factory in Dresden
Particle Measuring Systems introduces 10 nm aerosol particle counter
EBARA presents DYNOX Gas Abatement System
TSMC Launches OIP 3DFabric Alliance
DuPont reshapes IC materials manufacturing for post-COVID success
Evolving subfab vacuum challenges demand collaborative solutions
Next-gen low-k films can address present, future fabrication challenges
Critical Manufacturing redefines semiconductor MES for greater agility, success
Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Cutting FOPLP pattern distortion
EV Group advances leadership in optical lithography
ASM joins semiconductor climate consortium
KLA Launches New Double-Sided Direct Imaging Platform
Micron ships advanced DRAM technology with 1β node
Nor-Cal will do business as Pfeiffer Vacuum
ClassOne Equipment Releases Major New Lot of Used Semiconductor Tools for Resale
Park Systems Celebrates the Merger and Acquisition of Accurion GmbH
Amkor to support European semiconductor ecosystem
Nanometre components require sub-nanometre precision
ALD TechDay for More-than-Moore devices
Cadence Expands Collaboration with Samsung Foundry

{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: