+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
News Article

Cadence Expands Collaboration with Samsung Foundry

News

Cadence Design Systems, a collaborative partner in theSamsung Advanced Foundry Ecosystem (SAFE), has announced that it has expandedits collaboration with Samsung Foundry to accelerate 3D-IC design. Through thecontinued collaboration, the reference flow featuring the Cadence Integrity3D-IC platform has been enabled to advance Samsung Foundry's 3D-IC methodology.Using the Cadence platform, customers creating complex, next-generationhyperscale computing, mobile, automotive and AI applications can greatlyoptimize power, performance and area (PPA) for each die.


The PPA of a design can be impacted when chips are stackedin a 3D-IC configuration versus a 2D configuration due to the presence of large3D structures like TSVs, which connect the stacked chips. In addition toblocking standard cell placement area, these structures block routing resourcesas well. The Cadence Integrity 3D-IC platform alleviates these traditional challenges,letting users create multiple TSV insertion scenarios and devise an optimal 3Dstructure placement on a die with reduced wirelength penalties while boostingPPA and productivity. The platform also lets users perform 3D-IC designplanning, implementation and signoff from a single cockpit, making the designprocess faster and easier.


{inStory3}
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: