+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

Delivering automotive safety and security solutions

News

Infineon Technologies and Green Hills Software will provide a complete ecosystem for the development and deployment of advanced safety applications for the automotive industry.

This collaboration combines Infineon’s cutting-edge TRAVEO™ T2G Body and TRAVEO™ T2G Cluster microcontrollers (MCUs) with Green Hills’ comprehensive production-proven software solutions comprising:


the ultra-small and fast, ASIL-certified, μ-velOSity™ real-time operating system (RTOS), and

the ASIL-certified MULTI® advanced development environment.

By integrating these proprietary technologies, Infineon and Green Hills are providing original equipment manufacturers (OEMs) with a complete solution that offers dependable production-ready software to safely build and deploy automotive applications.


As the digitalization of the automotive industry continues and as eMobility offerings continue to evolve, OEMs are eager to provide consumers with new and innovative applications to differentiate their vehicles. Equally as important to OEMs is ensuring the safety and security of applications within today’s vehicles. The collaboration between Infineon and Green Hills addresses both of these elements without sacrificing performance or increasing memory demands of automotive applications. OEMs now have a comprehensive solution that is also easy to deploy, reducing costs and improving both developer productivity and product time-to-market.


Infineon’s TRAVEO T2G Body MCU family addresses a broad variety of automotive applications, including body control modules, door, window, sunroof and seat control units as well as in-cabin smartphone terminals and wireless charging units. Infineon’s TRAVEO T2G Cluster for instrument cluster enables a more robust and feature-rich graphics engine for automotive display systems, including extensive scalability, covering the conventional gauge instrument cluster, hybrid instrument cluster and virtual instrument cluster.


Green Hills’ µ-velOSity RTOS is a tiny, fast and easy-to-program, memory-efficient real-time operating system for a wide range of applications, including those with ASIL requirements. µ-velOSity needs only a few kilobytes of ROM and boots quickly in a minimum of processor cycles. The ultra-small context switch time and fast kernel service calls of this operating system (OS) also make it ideal for real-time automotive functions. And, the clear, concise application programming interface (API) reduces development time and improves product maintainability, cutting costs and speeding up time-to-market. In addition, for developers moving from standalone or no-OS configurations, µ-velOSity provides a well-established migration path.


Developers utilizing Infineon’s TRAVEO T2G Body MCU family of processors will see a significant increase in productivity by using the Green Hills MULTI advanced integrated development tools that include Green Hills optimizing C/C++ compilers. The unmatched performance and ASIL certification of Green Hills’ compilers and run-time libraries have made Green Hills the industry’s gold standard for C/C++ compilers. MULTI also features the most advanced multicore, multi-OS debugging and visualization capabilities that empower developers to find and fix bugs faster, use less processor memory, and reduce costly software recalls.


The combination of Infineon’s TRAVEO T2G MCUs and Green Hills’ complete production-proven software solutions is tailored for a broad range of automotive applications such as electrification, body control modules, gateway and infotainment. Through this collaboration, OEMs now have a complete integrated solution that can be quickly deployed with a low memory footprint while still maintaining optimal quality, high performance and system dependability.

SPEA donates test equipment to university in Thailand
SONOTEC and S3 Alliance join at SEMICON Europa
Luminaries like high-NA EUV and curvilinear photomasks
SensiML and Silicon Technology join forces
TRI launches high-performance 3D AXI
SONOTEC and S3 Alliance join at SEMICON Europa
Marquee Semiconductor expands Indian presence
Micron begins Memory Manufacturing Fab
SiLC Technologies advances Machine Vision
Renesas partners with EdgeCortix
Gradiant acquires H+E Group
Webinar: Hydrogen Generation Industry Innovations to Meet Expanding North American Fab Hydrogen Requirements
EdgeCortix set to disrupt the edge market?
Evonetix places first DNA Synthesis Development Platform at Imperial College London
ASE launches Integrated Design Ecosystem
Cohu acquires Equiptest Engineering
Advantest wins 2022 Best Supplier Award from ASE Holdings
SEMI welcomes new board members
Advanced Energy breaks ground on flagship factory
GlobalFoundries opens new Malaysia office
TSMC reveals 'breakthrough' set to redefine the future of 3D IC
Delphon announce new VP, strategic marketing & business development
Particle Measuring Systems Announces Acquisition of EMS
Ireland begins high-volume production of Intel 4 Technology
Advantest to showcase latest test solutions
200 gigabits per second
KemLab Inc. applauds CHIPS Act's commitment
200mm fabs to reach record capacity by 2026
Governor DeSantis dedicates $50 million for workforce development
DOD names eight 'Microelectronics Commons' Hubs
TSMC accelerates renewable energy adoption
Mouser signs global agreement with MediaTek
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: