Loading...
News Article

Reality AI Explorer Tier offers free AI/ML development access

News

Renesas Electronics has introduced Reality AI Explorer Tier, a free version of the popular Reality AI Tools® software for developing AI and TinyML solutions in industrial, automotive and commercial applications.

The new Reality AI Explorer Tier provides users with free access to a comprehensive, self-guided evaluation sandbox. Qualified customers can now access the complete range of features in Reality AI Tools, including automated AI model construction, validation and deployment modules. Reality AI Explorer Tier includes a rich library of tutorials, application examples, and FAQs, access to the community forum and email support. Users can quickly get started with a simplified click-through end user agreement within

Reality AI Explorer Tier is designed to simplify the customer experience for evaluating the development environment for embedded real-time analytics. Users can explore a variety of pre-built AI applications, offering a practical way to experience the capabilities of Reality AI Tools without the need for extensive setup or support. Examples allow the user to leverage Renesas Kits such as AI Kits with sample datasets that span use cases across accelerometry/vibration analysis, audio classification, and motor control.

“As AIoT becomes increasingly important, many customers are showing keen interest and developing expertise in building AI applications at the edge and endpoint,” said Mohammed Dogar, Vice President and Head of Business Development and Ecosystem for Renesas. “Reality AI Explorer offers the opportunity to experience the full potential of a market-leading AI development environment without any up-front cost. We are confident that many customers will use this platform as a first step to creating production AIoT implementations.”

“We have used Reality AI Tools extensively to deploy extremely cost-efficient AI solutions for automated quality assurance applications,” said Dr. Kilian von Neumann-Cosel, Head of Brose Silicon Valley. “We envision enabling a variety of embedded sensing applications through this powerful AI/ML development.”

Reality AI Tools is now tightly integrated with Renesas compute products and supports all Renesas MCUs and MPUs natively with a built-in parts picker engine. Support for automatic context switching between Reality AI Tools and e2 Studio, Renesas’ flagship embedded development environment, is also in place.

Winning Combinations

Renesas has combined its AI technology into numerous Winning Combinations across automotive, industrial, and IoT applications. These Winning Combinations highlight applications where Reality AI technology can enable intelligence to detect anomalies for preventative maintenance, which can provide customers with significant savings in repair costs. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized low-risk design for a faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly.

Silicon photonics: accelerating growth in the race for high-speed optical interconnects
CCD-in-CMOS technology enables ultra-fast burst mode imaging
2025 6G A look forward
Critical Manufacturing climbs Deloitte’s Technology Fast 50
Semiconductors: The most important thing you probably know the least about
Imec and partners unveil SWIR sensor with lead-free quantum dot photodiodes
Lattice introduces small and mid-range FPGA offerings
SEMI and SMT inspection solutions at NEPCON Japan 2025
Nordic Semiconductor and Kigen demonstrate Remote SIM Provisioning for Massive IoT
Spirent collaborates with Siemens
Quobly forges strategic collaboration with STMicroelectronics
New standards in pressure measurement systems for the semiconductor industry
IBM delivers optics breakthrough
Semiconductor equipment sales to reach $139 Billion in 2026
Marvell introduces 1.6 Tbps LPO Chipset
ACM research strengthens Atomic Layer Deposition portfolio
CEA-Leti demonstrates embedded FeRAM platform compatible with 22nm FD-SOI node
Lattice introduces small and mid-range FPGA offerings
Solace unlocks full potential of event-driven integration
Advantest to showcase latest test solutions at SEMICON Japan 2024
CEA-Leti device integrates light sensing and modulation
Nordic launches Thingy:91 X prototyping platform for cellular IoT and Wi-Fi locationing
Imec achieves seamless InP Chiplet integration on 300mm RF Silicon Interposer
High-precision SMU
Powering India’s energy future
China’s Nvidia probe puts global investors ‘on notice’
POET Technologies appoints new director
Imec demonstrates core building blocks of a scalable, CMOS-fab compatible superconducting digital technology
Imec proposes double-row CFET for the A7 technology node
ULVAC launches new deposition system
Beebolt and SEMI Announce Strategic Partnership to Drive Supplier Resilience and Agility
esmo group introduces Automated Final Test Manipulator
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
x
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: