+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

AMD highlights future of high-performance and adaptive computing

News

AMD CEO and partners including Microsoft, HP, Lenovo, Magic Leap and Intuitive Surgical showcase AMD technologies advancing AI, hybrid work, gaming, healthcare, aerospace and sustainable computing.

At CES 2023, AMD Chair and CEO Dr. Lisa Su detailed the significant role high-performance and adaptive computing plays in creating solutions to the world’s most important challenges. During her live keynote, Dr. Su showcased next-generation AMD leadership products redefining what's possible across the broad markets AMD serves today.


“It is an honor to kick off CES 2023 and highlight all the ways AMD is pushing the envelope in high-performance and adaptive computing to help solve the world’s most important challenges,” said Dr. Su. “Together with our partners, we highlighted how AMD technology is advancing what is possible in AI, hybrid work, gaming, healthcare, aerospace and sustainable computing. We also launched multiple new mobile, gaming and AI chips that will make 2023 an exciting year for AMD and the industry.”


AMD Product Innovation at CES 2023


Advancing PCs and Gaming: AMD announced new mobile and desktop processors to serve every type of user, from casual gamers and content creators to professionals and hybrid workers, along with new graphics solutions to bring the power of high-performance gaming to mobile:

The AMD Ryzen™ 7040 Series Mobile processors, featuring the 'fastest' PC processor graphics in the world with up to eight “Zen 4” cores and AMD RDNA 3 graphics 1.

As part of the new Ryzen 7040 Series Mobile processors, AMD also unveiled Ryzen AI Technology – the 'first' dedicated artificial intelligence hardware in an x86 processor.

AMD Ryzen 7045HX Series Processors for Mobile: Powered by up to 16 powerful “Zen 4” cores and 32 threads, the Ryzen 7045HX mobile processors are built on advanced 5nm process technology.

The AMD Ryzen 7000X3D Series processors with AMD 3D V-Cache™ technology, the 'fastest' gaming processors in the world 2.

AMD Radeon™ RX 7000 Series Graphics for Laptops based on the AMD RDNA™ 3 architecture offering ​'exceptional' energy efficiency and performance to power 1080p gaming at ultra settings and advanced content creation applications on next-generation premium laptops.


Advancing AI: Dr. Su shared the company’s latest advances to enable pervasive AI, including previewing new products to broaden its AI product portfolio from edge to cloud:

The AMD Alveo™ V70 AI Accelerator with industry-leading performance and energy efficiency for multiple AI inference workloads.

The world’s first integrated data center CPU and GPU, the AMD Instinct™ MI300. Designed for leadership HPC and AI performance, MI300 accelerators leverage a groundbreaking 3D chiplet design combining AMD CDNA™ 3 GPU architecture, “Zen 4” CPU cores, and HBM memory chiplets.


Advancing Healthcare: AMD adaptable computing and AI technology powers the world’s most important medical solutions, enabling faster diagnoses and drug discoveries and better patient care. At CES, AMD announced the AMD Vitis™ Medical Imaging libraries to bring premium medical imaging products to market faster by reducing development times. These software libraries accelerate premium medical imaging on AMD Versal™ SoC devices with AI Engines to deliver healthcare providers and their patients high-quality, low-latency imaging.


Advancing Aerospace: AMD adaptive computing solutions help satellites and spacecraft compute data and leverage pervasive AI to derive insights. During the keynote, Dr. Su shared how AMD FPGAs and adaptive SoCs are helping to shape the future of space exploration, powering recent space missions from Mars Curiosity and Perseverance to the recently launched Artemis moon mission.

Reality AI Explorer Tier offers free AI/ML development access
AEM introduces new generation of Automated Burn-In Systems
NPUs are emerging as the main rival to Nvidia’s AI dominance, says DAI Magister
Camtek receives a $20M order from a Tier-1 OSAT
Free samples of every STMicroelectronics NPI IC available from Anglia
NY CREATES and SEMI sign MoU
Major government investment to 'propel' Canada
QuickLogic announces $5.26 million contract award
ASNA and Athinia collaborate
Global sales forecast to reach record $109 billion in 2024
AMD to acquire Silo AI
Nanotronics unveils 'groundbreaking' Gen V AI Model
Aitomatic unveils SemiKong
Biden-Harris Administration reveals first CHIPS for America R&D facilities and selection processes
Collaboration to produce cutting-edge AI accelerator chips
Oxford Ionics breaks global quantum performance records
Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
AEM introduces new generation of Automated Burn-In Systems
Sydney council forges vital semiconductor agreement
EV Group's EVG880 LayerRelease wins 2024 Best of West
Biden-Harris Administration to invest up to $1.6 billion
Cyient sets up subsidiary for semiconductor business
EMD Electronics network leaders honoured
Accenture acquires Cientra
Introducing Park FX200
Deep learning chipset market to surge to $72.8 billion by 2033
PI Innovation Award 2024: Nanobodies for Diagnostic and Therapeutic Applications
Graphcore joins Softbank Group
Kaman Measuring highlights high precision displacement sensors
Si2 reveals recipients of Annual Power of Partnerships Award
Advantest achieves ASPICE Level 2 Certification for V93000 SmarTest 8 Software
Semiconductors to become a trillion-dollar industry by 2030
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • 1st January 1970
  • View all news 22645 more articles
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: