+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
 
Loading...
News Article

GUC delivers its first TSMC N3 chip

News

Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology.

Cadence Design Systems says that Global Unichip Corp. (GUC) successfully delivered an advanced HPC design and a CPU design using Cadence® digital solutions. The HPC design was created using the Cadence Innovus™ Implementation System on TSMC’s advanced N3 process and featured a 3.5 million instance count that reached clock speeds of up to 3.16GHz. The CPU design was created using the AI-enabled Cadence Cerebrus™ Intelligent Chip Explorer and the digital full flow on the TSMC N5 process technology, delivering 8% reduced power and a 9% area improvement while significantly improving engineering productivity.


The Innovus Implementation System’s 'highly accurate' GigaPlace engine provided GUC with support for TSMC FINFLEX™ cell row placement and consideration for pin access throughout the flow for N3 design rule checking (DRC) closure. The GigaOpt engine delivered improved optimization by enabling the most optimal configuration from the TSMC N3 library while balancing different cell row utilization. The Innovus Implementation System also includes a massively parallel architecture and incorporates the well-established NanoRoute engine, which enabled GUC to address signal integrity early in the design flow while improving post-route correlation.


Cadence Cerebrus, coupled with the Cadence digital flow, was instrumental in providing GUC with power, performance and area (PPA) benefits as well as the ability to perform synthesis through implementation and signoff on their 5nm CPU design, optimizing engineering team productivity. Unique to Cadence Cerebrus is its reinforcement learning engine that autonomously optimized GUC’s design flow, allowing the team to exceed human engineering potential and accelerate time to market.


“GUC is a market leader providing advanced chip solutions for AI, HPC, 5G, industrial and other emerging applications,” said Dr. Louis Lin, senior vice president of Design Services at GUC. “Given our commitment to deliver the most competitive designs to our customers, it is important for us to invest in leading-edge technologies. The Cadence Cerebrus Intelligent Chip Explorer, in conjunction with the broader digital flow, was the natural choice to help us achieve faster design turnaround via AI technology while also improving PPA. The Innovus Implementation System was instrumental in helping us deliver our first N3 chip, enabling our team to accelerate the creation of our high-performance, low-power HPC design.”

UK semiconductor strategy: A patent attorney’s perspective
Wafer cleaning market to reach US$ 17.2 billion
Solvay signs partnership agreement with Shengjian
ACM cleaning platform targets chiplets industry
Vietnam's thriving semiconductor industry fuels economic resilience
GSA celebrates women's innovation
The need for geofencing to help improve semiconductor IP security
All roads lead to Arizona
Time to celebrate and accelerate diversity, equity and inclusion
Cadence completes acquisition of PHY IP assets from Rambus
Wales joins the European Semiconductor Regional Alliance
Magnachip targets EV market
Greene Tweed: When it can’t fail
Advanced Packaging market Size to reach $66.9 billion by 2032
Inventec and Renesas to develop PoC for automotive gateways
Renesas commences Sequans tender offer
Tower Semiconductor and InnoLight partner
Flanders Semiconductors - a new hub in the heart of Europe
Ambiq wins Demo of the Year Award
Advanced packaging market nears US$90 billion
Intel Foundry Services and Tower Semiconductor reach US foundry agreement
MediaTek develops first chip using TSMC's 3nm Process
Advanced X-ray technology for advanced packaging
New developments in underlayers and their role in advancing EUV lithography
Advanced SAM validates integrity of electrostatic chucks
Purdue establishes permanent presence next to NSWC Crane
Bolstering semiconductor ecosystem at Texas A&M University
Semiconductor industry sees revenue increase for the first time since 2021
Bosch completes TSI Semiconductors acquisition
Semiconductor grants for undergraduate women
Sustainability rises up the automotive agenda
Lumibird completes Prima acquisitions
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Silicon Semiconductor Magazine, the Silicon Semiconductor Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: